XC2VP2-7FGG456C
XC2VP2-7FGG456C
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rohs

AMD Xilinx

XC2VP2-7FGG456C


XC2VP2-7FGG456C
F20-XC2VP2-7FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA456,22X22,40
BGA, BGA456,22X22,40

XC2VP2-7FGG456C ECAD Model


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XC2VP2-7FGG456C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 156
Number of Outputs 156
Number of Logic Cells 3168
Number of CLBs 352
Combinatorial Delay of a CLB-Max 280 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 352 CLBS
Clock Frequency-Max 1.35 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA456,22X22,40
Pin Count 456
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2VP2-7FGG456C Datasheet Download


XC2VP2-7FGG456C Overview



The XC2VP2-7FGG456C chip model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a highly integrated and cost-effective solution that requires the use of hardware description language (HDL). This chip model has been designed to provide a wide range of features and capabilities, while maintaining a high level of performance.


The XC2VP2-7FGG456C chip model offers a wide range of features and capabilities, including high clock frequency, low power consumption, and high-speed I/O. The chip model also supports a wide range of communication protocols, including Ethernet, USB, CAN, and SPI. The chip model also supports a wide range of memory types, including SRAM, DRAM, and Flash. Additionally, the chip model has an on-chip FPGA, which supports a wide range of logic designs and custom logic functions.


The XC2VP2-7FGG456C chip model is widely used in a variety of industries, including medical, automotive, consumer electronics, and industrial applications. The chip model is also used in a wide range of embedded systems, such as GPS, cellular phones, and other wireless communication systems. Additionally, the chip model is also used in a variety of image processing applications, such as facial recognition, object recognition, and image segmentation.


The design of the XC2VP2-7FGG456C chip model requires a detailed understanding of the hardware description language (HDL). The HDL language is used to describe the design of the chip model, including the logic functions, memory types, and communication protocols. Additionally, the HDL language can be used to create custom logic functions and to optimize the design of the chip model.


When designing the XC2VP2-7FGG456C chip model, it is important to consider the specific design requirements of the application. For example, the clock frequency and power consumption of the chip model should be considered when designing the chip model. Additionally, the memory types and communication protocols should be considered when designing the chip model. Additionally, the design of the chip model should also consider the specific requirements of the application, such as the number of I/O pins, the size of the memory, and the type of logic functions used.


In addition to the design of the XC2VP2-7FGG456C chip model, it is also important to consider the expected demand trends for the model in related industries in the future. For example, the demand for the chip model is expected to increase in the medical, automotive, and consumer electronics industries. Additionally, the demand for the chip model is expected to increase in the embedded systems, such as GPS, cellular phones, and other wireless communication systems.


Finally, when designing the XC2VP2-7FGG456C chip model, it is important to consider actual case studies and precautions. For example, it is important to consider the potential risks associated with the design of the chip model, such as the potential for data loss or corruption. Additionally, it is important to consider the potential for hardware and software malfunctions. Additionally, it is important to consider the potential for interference with other systems or devices. By considering actual case studies and precautions, designers can ensure that the design of the chip model is reliable and efficient.



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