
AMD Xilinx
XC2VP2-7FGG456C
XC2VP2-7FGG456C ECAD Model
XC2VP2-7FGG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 156 | |
Number of Outputs | 156 | |
Number of Logic Cells | 3168 | |
Number of CLBs | 352 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 352 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA456,22X22,40 | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2VP2-7FGG456C Datasheet Download
XC2VP2-7FGG456C Overview
The XC2VP2-7FGG456C chip model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a highly integrated and cost-effective solution that requires the use of hardware description language (HDL). This chip model has been designed to provide a wide range of features and capabilities, while maintaining a high level of performance.
The XC2VP2-7FGG456C chip model offers a wide range of features and capabilities, including high clock frequency, low power consumption, and high-speed I/O. The chip model also supports a wide range of communication protocols, including Ethernet, USB, CAN, and SPI. The chip model also supports a wide range of memory types, including SRAM, DRAM, and Flash. Additionally, the chip model has an on-chip FPGA, which supports a wide range of logic designs and custom logic functions.
The XC2VP2-7FGG456C chip model is widely used in a variety of industries, including medical, automotive, consumer electronics, and industrial applications. The chip model is also used in a wide range of embedded systems, such as GPS, cellular phones, and other wireless communication systems. Additionally, the chip model is also used in a variety of image processing applications, such as facial recognition, object recognition, and image segmentation.
The design of the XC2VP2-7FGG456C chip model requires a detailed understanding of the hardware description language (HDL). The HDL language is used to describe the design of the chip model, including the logic functions, memory types, and communication protocols. Additionally, the HDL language can be used to create custom logic functions and to optimize the design of the chip model.
When designing the XC2VP2-7FGG456C chip model, it is important to consider the specific design requirements of the application. For example, the clock frequency and power consumption of the chip model should be considered when designing the chip model. Additionally, the memory types and communication protocols should be considered when designing the chip model. Additionally, the design of the chip model should also consider the specific requirements of the application, such as the number of I/O pins, the size of the memory, and the type of logic functions used.
In addition to the design of the XC2VP2-7FGG456C chip model, it is also important to consider the expected demand trends for the model in related industries in the future. For example, the demand for the chip model is expected to increase in the medical, automotive, and consumer electronics industries. Additionally, the demand for the chip model is expected to increase in the embedded systems, such as GPS, cellular phones, and other wireless communication systems.
Finally, when designing the XC2VP2-7FGG456C chip model, it is important to consider actual case studies and precautions. For example, it is important to consider the potential risks associated with the design of the chip model, such as the potential for data loss or corruption. Additionally, it is important to consider the potential for hardware and software malfunctions. Additionally, it is important to consider the potential for interference with other systems or devices. By considering actual case studies and precautions, designers can ensure that the design of the chip model is reliable and efficient.
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