
AMD Xilinx
XC2VP2-5FG456I
XC2VP2-5FG456I ECAD Model
XC2VP2-5FG456I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 156 | |
Number of Outputs | 156 | |
Number of Logic Cells | 3168 | |
Number of CLBs | 352 | |
Combinatorial Delay of a CLB-Max | 360 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 352 CLBS | |
Clock Frequency-Max | 1.05 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA456,22X22,40 | |
Pin Count | 456 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2VP2-5FG456I Datasheet Download
XC2VP2-5FG456I Overview
The XC2VP2-5FG456I chip model is an advanced technology developed by leading chip manufacturer Xilinx. It is a field-programmable gate array (FPGA) chip that is designed to meet the needs of high-performance systems. It is suitable for a wide range of applications, from embedded systems to telecommunications networks.
The XC2VP2-5FG456I chip model is designed to provide high-speed data transfer, low latency, and low power consumption. It is equipped with multiple configurable I/O ports and can support up to 8 DSP cores. It also comes with a high-speed transceiver, which can be used to support high-speed serial communications. This chip model is also equipped with a high-performance memory controller, which can be used to support high-performance memory access.
In terms of industry trends, the XC2VP2-5FG456I chip model is expected to be widely adopted in the coming years, as it is capable of meeting the demands of high-performance systems. It is also expected to be used in a variety of applications, such as embedded systems, telecommunications networks, and intelligent systems.
In terms of future applications, the XC2VP2-5FG456I chip model is expected to be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and smart home systems. It is also expected to be used in the era of fully intelligent systems, as it is capable of providing high-speed data transfer, low latency, and low power consumption.
In terms of product description and design requirements, the XC2VP2-5FG456I chip model is designed to meet the needs of high-performance systems. It is equipped with multiple configurable I/O ports and can support up to 8 DSP cores. It also comes with a high-speed transceiver and a high-performance memory controller.
In terms of actual case studies, the XC2VP2-5FG456I chip model has been used in a variety of applications, such as embedded systems, telecommunications networks, and intelligent systems. It has also been used in autonomous driving, robotics, and smart home systems.
In terms of precautions, the XC2VP2-5FG456I chip model should be used in accordance with the manufacturer's instructions. It should also be used in accordance with the applicable safety and security regulations. Additionally, it should be used in accordance with the applicable environmental regulations.
In conclusion, the XC2VP2-5FG456I chip model is an advanced technology developed by leading chip manufacturer Xilinx. It is designed to meet the needs of high-performance systems and is expected to be widely adopted in the coming years. It is suitable for a variety of applications, such as embedded systems, telecommunications networks, and intelligent systems. It is also equipped with multiple configurable I/O ports and can support up to 8 DSP cores. It has been used in a variety of applications and should be used in accordance with the manufacturer's instructions, applicable safety and security regulations, and applicable environmental regulations.
You May Also Be Interested In
3,635 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $100.4402 | $100.4402 |
10+ | $99.3602 | $993.6018 |
100+ | $93.9602 | $9,396.0174 |
1000+ | $88.5602 | $44,280.0820 |
10000+ | $81.0002 | $81,000.1500 |
The price is for reference only, please refer to the actual quotation! |