XC2VP2-5FG456I
XC2VP2-5FG456I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC2VP2-5FG456I


XC2VP2-5FG456I
F20-XC2VP2-5FG456I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA456,22X22,40
BGA, BGA456,22X22,40

XC2VP2-5FG456I ECAD Model


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XC2VP2-5FG456I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 156
Number of Outputs 156
Number of Logic Cells 3168
Number of CLBs 352
Combinatorial Delay of a CLB-Max 360 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 352 CLBS
Clock Frequency-Max 1.05 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA456,22X22,40
Pin Count 456
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2VP2-5FG456I Datasheet Download


XC2VP2-5FG456I Overview



The XC2VP2-5FG456I chip model is an advanced technology developed by leading chip manufacturer Xilinx. It is a field-programmable gate array (FPGA) chip that is designed to meet the needs of high-performance systems. It is suitable for a wide range of applications, from embedded systems to telecommunications networks.


The XC2VP2-5FG456I chip model is designed to provide high-speed data transfer, low latency, and low power consumption. It is equipped with multiple configurable I/O ports and can support up to 8 DSP cores. It also comes with a high-speed transceiver, which can be used to support high-speed serial communications. This chip model is also equipped with a high-performance memory controller, which can be used to support high-performance memory access.


In terms of industry trends, the XC2VP2-5FG456I chip model is expected to be widely adopted in the coming years, as it is capable of meeting the demands of high-performance systems. It is also expected to be used in a variety of applications, such as embedded systems, telecommunications networks, and intelligent systems.


In terms of future applications, the XC2VP2-5FG456I chip model is expected to be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and smart home systems. It is also expected to be used in the era of fully intelligent systems, as it is capable of providing high-speed data transfer, low latency, and low power consumption.


In terms of product description and design requirements, the XC2VP2-5FG456I chip model is designed to meet the needs of high-performance systems. It is equipped with multiple configurable I/O ports and can support up to 8 DSP cores. It also comes with a high-speed transceiver and a high-performance memory controller.


In terms of actual case studies, the XC2VP2-5FG456I chip model has been used in a variety of applications, such as embedded systems, telecommunications networks, and intelligent systems. It has also been used in autonomous driving, robotics, and smart home systems.


In terms of precautions, the XC2VP2-5FG456I chip model should be used in accordance with the manufacturer's instructions. It should also be used in accordance with the applicable safety and security regulations. Additionally, it should be used in accordance with the applicable environmental regulations.


In conclusion, the XC2VP2-5FG456I chip model is an advanced technology developed by leading chip manufacturer Xilinx. It is designed to meet the needs of high-performance systems and is expected to be widely adopted in the coming years. It is suitable for a variety of applications, such as embedded systems, telecommunications networks, and intelligent systems. It is also equipped with multiple configurable I/O ports and can support up to 8 DSP cores. It has been used in a variety of applications and should be used in accordance with the manufacturer's instructions, applicable safety and security regulations, and applicable environmental regulations.



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Unit Price: $108.0002
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Pricing (USD)

QTY Unit Price Ext Price
1+ $100.4402 $100.4402
10+ $99.3602 $993.6018
100+ $93.9602 $9,396.0174
1000+ $88.5602 $44,280.0820
10000+ $81.0002 $81,000.1500
The price is for reference only, please refer to the actual quotation!

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