AMD Xilinx
XC2V500-6FG456I
XC2V500-6FG456I ECAD Model
XC2V500-6FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 264 | |
| Number of Outputs | 264 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 768 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 768 CLBS, 500000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V500-6FG456I Datasheet Download
XC2V500-6FG456I Overview
The chip model XC2V500-6FG456I is a semiconductor device that has been developed by Xilinx, a leading provider of programmable logic devices. This chip model is specifically designed to meet the demands of high-performance applications such as embedded systems and networking. It features a low power consumption, high speed, and high density of logic gates, making it suitable for many different applications.
The XC2V500-6FG456I is a cost-effective solution for many industries, especially those that require high-performance solutions. With its high speed, low power consumption, and high density of logic gates, the chip model is perfect for applications such as embedded systems, networking, and communications. In addition, it is also suitable for applications such as artificial intelligence (AI) and machine learning (ML), as it can provide the necessary computing power for these applications.
The chip model XC2V500-6FG456I is expected to be in high demand in the future, as more and more applications are being developed that require high-performance solutions. As the demand for high-performance solutions increases, the chip model XC2V500-6FG456I is likely to become even more popular in the future.
The chip model XC2V500-6FG456I is also suitable for use in networks and in intelligent scenarios. It can be used to provide the necessary computing power for applications such as AI and ML, as well as for applications such as robotics and autonomous vehicles. In addition, the chip model is also suitable for use in the era of fully intelligent systems, as it can provide the necessary computing power for these systems.
Overall, the chip model XC2V500-6FG456I is a cost-effective solution for many industries, as it provides high-performance solutions at a reasonable price. It is suitable for applications such as embedded systems, networking, communications, AI, ML, and autonomous vehicles, making it an ideal choice for many different applications. As the demand for high-performance solutions increases, the chip model XC2V500-6FG456I is expected to become even more popular in the future.
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|---|---|---|
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