AMD Xilinx
XC2V500-4FG456C
XC2V500-4FG456C ECAD Model
XC2V500-4FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 264 | |
| Number of Outputs | 264 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 768 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 768 CLBS, 500000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V500-4FG456C Datasheet Download
XC2V500-4FG456C Overview
The chip model XC2V500-4FG456C is a powerful integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, a hardware description language that allows users to create and modify digital designs. This chip model provides a number of benefits, including high-speed processing, low power consumption, and a small form factor.
The XC2V500-4FG456C is expected to be in high demand in the coming years, particularly in industries where digital signal processing is necessary. This includes fields such as artificial intelligence, robotics, and autonomous vehicles. Additionally, the chip model is expected to be used in advanced communication systems, such as 5G networks, due to its high-speed processing capabilities and low power consumption.
The original design intention of the XC2V500-4FG456C was to provide users with a powerful, yet efficient, integrated circuit for digital signal processing. The chip model was designed with the HDL language in mind, allowing for a more efficient design process. The chip model has the potential to be upgraded in the future, allowing for more advanced features and capabilities. This could include increased processing speed, higher power efficiency, and the ability to support more complex tasks.
Overall, the XC2V500-4FG456C is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the coming years due to its powerful capabilities and low power consumption. Additionally, the chip model has the potential to be upgraded in the future, allowing for more advanced features and capabilities.
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3,179 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $45.2963 | $45.2963 |
| 10+ | $44.8092 | $448.0924 |
| 100+ | $42.3740 | $4,237.3959 |
| 1000+ | $39.9387 | $19,969.3370 |
| 10000+ | $36.5293 | $36,529.2750 |
| The price is for reference only, please refer to the actual quotation! | ||