AMD Xilinx
XC2V3000-6BGG728I
XC2V3000-6BGG728I ECAD Model
XC2V3000-6BGG728I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B728 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 728 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA728,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA728,27X27,50 | |
| Pin Count | 728 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-6BGG728I Datasheet Download
XC2V3000-6BGG728I Overview
The XC2V3000-6BGG728I chip model is a multi-function, high-performance chip that has been developed to meet the increasing demand for advanced communication systems. This chip model is equipped with a variety of features, such as high-speed data transmission, low power consumption, and high-precision data processing capabilities. It is also capable of supporting a wide range of communication protocols, making it an ideal choice for various applications.
The main advantages of the XC2V3000-6BGG728I chip model include its low power consumption, high-speed data transmission, and high-precision data processing capabilities. This chip model is designed to provide the best performance and reliability for the most demanding applications. It is also designed to be highly scalable and can be easily upgraded to meet the changing needs of the industry.
The XC2V3000-6BGG728I chip model is expected to be in high demand in the future due to its ability to provide high-speed data transmission, low power consumption, and high-precision data processing capabilities. This chip model can be used in a variety of applications, such as networks, intelligent scenarios, and fully intelligent systems. It is also capable of supporting a wide range of communication protocols, making it an ideal choice for advanced communication systems.
The XC2V3000-6BGG728I chip model is designed to be highly scalable and can be easily upgraded to meet the changing needs of the industry. This chip model is also capable of supporting a wide range of communication protocols, making it an ideal choice for various applications. In addition, this chip model is capable of providing high-speed data transmission, low power consumption, and high-precision data processing capabilities, making it suitable for use in a variety of networks and intelligent scenarios.
In conclusion, the XC2V3000-6BGG728I chip model is an ideal choice for advanced communication systems due to its low power consumption, high-speed data transmission, and high-precision data processing capabilities. This chip model is expected to be in high demand in the future due to its ability to provide high-speed data transmission, low power consumption, and high-precision data processing capabilities. It is also capable of supporting a wide range of communication protocols, making it an ideal choice for various applications. Furthermore, this chip model is highly scalable and can be easily upgraded to meet the changing needs of the industry. This chip model is also capable of providing high-speed data transmission, low power consumption, and high-precision data processing capabilities, making it suitable for use in a variety of networks and intelligent scenarios.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||