AMD Xilinx
XC2V3000-5BGG728C
XC2V3000-5BGG728C ECAD Model
XC2V3000-5BGG728C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B728 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 728 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA728,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA728,27X27,50 | |
| Pin Count | 728 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-5BGG728C Datasheet Download
XC2V3000-5BGG728C Overview
Chip model XC2V3000-5BGG728C is a highly advanced chip that has been designed to meet the needs of the modern world. It is a powerful chip that is capable of handling a wide variety of tasks and applications. It has been designed to provide a high level of performance and reliability, as well as being able to provide support for a wide range of technologies.
The chip model XC2V3000-5BGG728C was designed with the intention of being able to meet the needs of the modern world. It is capable of handling a wide range of tasks and applications. It is also capable of providing support for a wide range of technologies. This includes support for advanced communication systems, as well as being able to be used in networks and intelligent scenarios.
The chip model XC2V3000-5BGG728C is capable of being upgraded to meet the needs of the future. This includes being able to provide support for new technologies that may be required in the future. It is also possible to use the chip model in the era of fully intelligent systems. This is due to the fact that the chip model is capable of being used in networks and intelligent scenarios.
The chip model XC2V3000-5BGG728C is an advanced chip that is designed to meet the needs of the modern world. It is capable of handling a wide range of tasks and applications. It is also capable of providing support for a wide range of technologies. This includes support for advanced communication systems, as well as being able to be used in networks and intelligent scenarios. It is also possible to upgrade the chip model to meet the needs of the future and to provide support for new technologies that may be required in the future. This makes the chip model XC2V3000-5BGG728C a highly versatile chip that is capable of being used in a variety of applications and scenarios.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||