AMD Xilinx
XC2V3000-4BGG728I
XC2V3000-4BGG728I ECAD Model
XC2V3000-4BGG728I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B728 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 728 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA728,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA728,27X27,50 | |
| Pin Count | 728 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-4BGG728I Datasheet Download
XC2V3000-4BGG728I Overview
Chip model XC2V3000-4BGG728I is a high-end FPGA chip from Xilinx. It is a member of the Virtex-II Pro series of FPGA chips, and is designed for high-end communication applications. This chip has many advantages that make it a great choice for advanced communication systems.
The XC2V3000-4BGG728I chip is designed to provide a wide range of features and performance. It has a high-speed, low-power static RAM, which supports up to 256Mb of memory. This chip also has a high-speed serial transceiver, which supports up to 10Gbps data transmission. It also has a high-speed, low-power DSP core, which provides up to 300MHz of performance. Additionally, the chip has a wide range of I/O options, including LVDS, LVCMOS, and SDRAM.
The XC2V3000-4BGG728I chip is designed to meet the needs of advanced communication systems. It is suitable for applications such as high-speed data transmission, high-speed signal processing, and high-speed data storage. It can also be used in high-speed networking applications, such as 10G Ethernet, and in high-speed digital signal processing applications.
The XC2V3000-4BGG728I chip is a highly reliable and cost-effective solution for advanced communication systems. It has a high-speed serial transceiver, which supports up to 10Gbps data transmission. It also has a high-speed, low-power static RAM, which supports up to 256Mb of memory. Additionally, the chip has a wide range of I/O options, including LVDS, LVCMOS, and SDRAM.
The XC2V3000-4BGG728I chip is designed to be upgradeable in the future. It has a high-speed, low-power DSP core, which provides up to 300MHz of performance. It also has a high-speed serial transceiver, which supports up to 10Gbps data transmission. Additionally, the chip has a wide range of I/O options, including LVDS, LVCMOS, and SDRAM.
The XC2V3000-4BGG728I chip is designed to meet the needs of advanced communication systems. It is suitable for applications such as high-speed data transmission, high-speed signal processing, and high-speed data storage. It can also be used in high-speed networking applications, such as 10G Ethernet, and in high-speed digital signal processing applications.
The XC2V3000-4BGG728I chip is designed to be reliable and cost-effective. It has been tested and proven to be reliable in a variety of applications. Additionally, it is designed to be upgradeable in the future, allowing it to keep up with the changing needs of advanced communication systems.
The demand for the XC2V3000-4BGG728I chip is expected to continue to grow in the future. This is due to its high-speed, low-power design, its reliability, and its ability to be upgraded in the future. As more advanced communication systems are developed, the demand for this chip will likely increase.
When using the XC2V3000-4BGG728I chip, it is important to take certain precautions. It is important to ensure that the chip is properly installed and configured, as improper configuration can lead to errors and poor performance. Additionally, it is important to ensure that the chip is regularly updated to ensure that it is running the latest version of the software.
In conclusion, the XC2V3000-4BGG728I chip is a high-end FPGA chip from Xilinx. It has a high-speed, low-power static RAM, a high-speed serial transceiver, and a high-speed, low-power DSP core. It is suitable for applications such as high-speed data transmission, high-speed signal processing, and high-speed data storage. It is designed to be reliable and cost-effective, and is expected to be in high demand in the future. When using the chip, it is important to take certain precautions to ensure that it is properly installed and configured, and regularly updated.
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