AMD Xilinx
XC2V3000-4BGG728C
XC2V3000-4BGG728C ECAD Model
XC2V3000-4BGG728C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B728 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 728 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA728,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA728,27X27,50 | |
| Pin Count | 728 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-4BGG728C Datasheet Download
XC2V3000-4BGG728C Overview
The XC2V3000-4BGG728C chip model is a powerful, high-performance and versatile device that provides a comprehensive set of features and capabilities. It is one of the most popular models in the market due to its impressive performance and reliability. It is designed to meet the needs of various industries, including communications, computing, and industrial automation.
The XC2V3000-4BGG728C chip model is designed to provide a high level of performance and scalability. It offers a wide range of features and capabilities, including high-speed data processing, advanced communication, and increased system integration. It also provides a variety of interfaces, including Ethernet, USB, and serial ports. It also offers a wide range of configurations and can be used in a variety of applications.
The XC2V3000-4BGG728C chip model is designed to be future-proof, and it is expected that demand for this model will continue to increase in the coming years. It is expected that the chip model will be used in a variety of applications, including advanced communications systems, networks, and intelligent systems. It is also expected that the chip model will be used in the future to create fully intelligent systems, such as self-driving cars, intelligent robots, and smart homes.
The XC2V3000-4BGG728C chip model is designed to be upgradable and can be used in a variety of advanced communication systems. It is also designed to be used in the era of fully intelligent systems, and it is expected that it will be able to support a variety of intelligent scenarios. It is also expected that the chip model will be able to support a variety of networks and be used in a variety of applications.
The XC2V3000-4BGG728C chip model is an impressive device that provides a comprehensive set of features and capabilities. It is designed to be future-proof and is expected to be used in a variety of applications in the future. It is also expected that the chip model will be able to support a variety of networks and be used in the era of fully intelligent systems. It is an impressive device that provides a comprehensive set of features and capabilities and is expected to be in high demand in the coming years.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||