AMD Xilinx
XC2V250-6FGG456I
XC2V250-6FGG456I ECAD Model
XC2V250-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 200 | |
| Number of Outputs | 200 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA456,22X22,40 | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V250-6FGG456I Datasheet Download
XC2V250-6FGG456I Overview
The XC2V250-6FGG456I chip model is a powerful and reliable integrated circuit, designed for high performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, and is capable of providing a high level of performance and reliability.
The XC2V250-6FGG456I chip model is designed to be used with the HDL language, which is a language used for designing and programming digital circuits. This language is used to create the logic and control structures that are used to control the chip's behavior. The chip model is also designed to be compatible with several different development tools, allowing for a wide range of applications.
The XC2V250-6FGG456I chip model can be used in a variety of scenarios, including networking scenarios and intelligent systems. It is capable of providing a high level of performance and reliability, and can be used in the era of fully intelligent systems. The chip model is able to process large amounts of data quickly and accurately, and can be used in a variety of applications.
When designing with the XC2V250-6FGG456I chip model, it is important to consider the product description and specific design requirements. It is also important to consider any potential problems or issues that may arise when using the chip model. It is also important to consider any potential risks associated with using the chip model, such as the potential for data loss or corruption.
In addition to product description and design requirements, actual case studies and precautions should be considered when designing with the XC2V250-6FGG456I chip model. Actual case studies can provide valuable insight into how the chip model can be used in a variety of applications, and can provide valuable information about potential issues or risks associated with the chip model. Precautions should also be taken to ensure that the chip model is being used in a safe and secure manner, and that any data that is being processed is being done so securely.
The XC2V250-6FGG456I chip model is a powerful and reliable integrated circuit, designed for high performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, and can be used in a variety of scenarios, including networking scenarios and intelligent systems. It is important to consider the product description and design requirements, as well as actual case studies and precautions, when designing with the XC2V250-6FGG456I chip model. With the right design and precautions, the XC2V250-6FGG456I chip model can be used to provide a high level of performance and reliability in a variety of applications.
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|---|---|---|
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