AMD Xilinx
XC2V250-6FGG256I
XC2V250-6FGG256I ECAD Model
XC2V250-6FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V250-6FGG256I Datasheet Download
XC2V250-6FGG256I Overview
The XC2V250-6FGG256I chip model is the latest offering from Xilinx, Inc. and is designed to provide a high-performance, low-cost solution for a variety of applications. This model features a high-speed, low-power FPGA with 256K of embedded memory. It is ideal for applications such as embedded systems, automotive, industrial, and communications.
The XC2V250-6FGG256I chip model has several advantages over other models. It has a high-speed, low-power design that allows it to operate at high speeds while consuming less power than other chips. Additionally, it has a large amount of embedded memory, allowing it to store more data than other chips. This makes it an ideal choice for applications that require large amounts of data storage.
The XC2V250-6FGG256I chip model is also designed to be easily upgradable. This allows users to upgrade the chip as new technologies become available, ensuring that the chip remains up to date with the latest technologies. Additionally, the chip can be used in advanced communication systems, providing a reliable and secure connection between devices.
The XC2V250-6FGG256I chip model is also being used to develop and popularize future intelligent robots. This is due to its ability to store large amounts of data, as well as its low-power, high-speed design. With the use of this chip model, robots can be programmed to perform complex tasks, such as recognizing objects and responding to voice commands.
In order to use the XC2V250-6FGG256I chip model effectively, users will need to have a strong technical background. This includes knowledge of programming languages such as Verilog and VHDL, as well as knowledge of embedded systems and robotics. Additionally, users should have a good understanding of the chip model itself, as well as its various features and applications.
The demand for the XC2V250-6FGG256I chip model is expected to increase in the future, as more applications and technologies become available. This chip model is ideal for a variety of applications, making it an attractive option for many industries. As the demand for this chip model increases, it is likely that it will become more widely available and more affordable.
In conclusion, the XC2V250-6FGG256I chip model is a powerful, low-cost solution that is ideal for a variety of applications. It is designed to be easily upgradable and can be used in advanced communication systems. Additionally, it is being used to develop and popularize future intelligent robots. In order to use the chip model effectively, users will need to have a strong technical background. The demand for this chip model is expected to increase in the future, making it an attractive option for many industries.
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