AMD Xilinx
XC2V250-6FG456I
XC2V250-6FG456I ECAD Model
XC2V250-6FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 200 | |
| Number of Outputs | 200 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V250-6FG456I Datasheet Download
XC2V250-6FG456I Overview
The chip model XC2V250-6FG456I is a powerful integrated circuit that has been widely used in many industries for its excellent performance. It is a field programmable gate array (FPGA) that is designed to provide fast and efficient data processing capabilities. It is mainly used in the fields of digital signal processing, communications, and embedded systems.
In terms of industry trends, the chip model XC2V250-6FG456I is expected to continue to be widely used in the future. With the development of advanced technologies, it is possible that the chip model XC2V250-6FG456I will be upgraded to meet the needs of new applications. For example, the chip model XC2V250-6FG456I can be used in advanced communication systems, such as 5G, and the chip model XC2V250-6FG456I can also be used in networks and intelligent scenarios.
In addition, the chip model XC2V250-6FG456I is also expected to be widely used in the era of fully intelligent systems. The chip model XC2V250-6FG456I is capable of providing high-speed data processing and can be used to develop intelligent systems. For example, the chip model XC2V250-6FG456I can be used to develop artificial intelligence (AI) systems, such as natural language processing (NLP) and computer vision (CV).
Overall, the chip model XC2V250-6FG456I is a powerful integrated circuit that has been widely used in many industries. It is expected to continue to be widely used in the future, as it can be upgraded to meet the needs of new applications and can be used in the era of fully intelligent systems. The chip model XC2V250-6FG456I can provide fast and efficient data processing capabilities and can be used to develop AI systems, such as NLP and CV.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||