
AMD Xilinx
XC2V250-6FG456C
XC2V250-6FG456C ECAD Model
XC2V250-6FG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 200 | |
Number of Outputs | 200 | |
Number of Logic Cells | 3456 | |
Number of Equivalent Gates | 250000 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 250000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2V250-6FG456C Datasheet Download
XC2V250-6FG456C Overview
The XC2V250-6FG456C chip model is a high-performance, low-power FPGA device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in the HDL language, which is a high-level language specifically designed for digital devices. The XC2V250-6FG456C chip model is built with advanced features such as high-speed I/O, high-speed memory, and a wide range of logic and arithmetic functions.
The product description of the XC2V250-6FG456C chip model includes details on its features, design requirements, and the advantages of using it. It is designed to be used in a wide variety of applications, such as digital signal processing, embedded processing, and image processing. The XC2V250-6FG456C chip model is equipped with high-speed I/O, high-speed memory, and a wide range of logic and arithmetic functions, making it a powerful and reliable device for these applications.
In addition to the product description, actual case studies and precautions are also available for the XC2V250-6FG456C chip model. These case studies and precautions provide detailed information on how to use the device properly and effectively, as well as how to avoid potential problems. This information is invaluable for engineers and designers who are using the XC2V250-6FG456C chip model in their projects.
The XC2V250-6FG456C chip model can be used in the development and popularization of future intelligent robots. This device is equipped with advanced features such as high-speed I/O, high-speed memory, and a wide range of logic and arithmetic functions, making it ideal for use in robotic applications. To use the XC2V250-6FG456C chip model effectively in the development of intelligent robots, engineers and designers must possess a strong understanding of the HDL language and the device's features and design requirements. In addition, they must have a good understanding of the principles of robotics and artificial intelligence, as well as knowledge of the hardware and software components of the robot. With this knowledge and expertise, engineers and designers can effectively use the XC2V250-6FG456C chip model in the development of intelligent robots.
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