XC2V250-6FG456C
XC2V250-6FG456C
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rohs

AMD Xilinx

XC2V250-6FG456C


XC2V250-6FG456C
F20-XC2V250-6FG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456
23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456

XC2V250-6FG456C ECAD Model


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XC2V250-6FG456C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 200
Number of Outputs 200
Number of Logic Cells 3456
Number of Equivalent Gates 250000
Number of CLBs 384
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 384 CLBS, 250000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456
Pin Count 456
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2V250-6FG456C Datasheet Download


XC2V250-6FG456C Overview



The XC2V250-6FG456C chip model is a high-performance, low-power FPGA device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in the HDL language, which is a high-level language specifically designed for digital devices. The XC2V250-6FG456C chip model is built with advanced features such as high-speed I/O, high-speed memory, and a wide range of logic and arithmetic functions.


The product description of the XC2V250-6FG456C chip model includes details on its features, design requirements, and the advantages of using it. It is designed to be used in a wide variety of applications, such as digital signal processing, embedded processing, and image processing. The XC2V250-6FG456C chip model is equipped with high-speed I/O, high-speed memory, and a wide range of logic and arithmetic functions, making it a powerful and reliable device for these applications.


In addition to the product description, actual case studies and precautions are also available for the XC2V250-6FG456C chip model. These case studies and precautions provide detailed information on how to use the device properly and effectively, as well as how to avoid potential problems. This information is invaluable for engineers and designers who are using the XC2V250-6FG456C chip model in their projects.


The XC2V250-6FG456C chip model can be used in the development and popularization of future intelligent robots. This device is equipped with advanced features such as high-speed I/O, high-speed memory, and a wide range of logic and arithmetic functions, making it ideal for use in robotic applications. To use the XC2V250-6FG456C chip model effectively in the development of intelligent robots, engineers and designers must possess a strong understanding of the HDL language and the device's features and design requirements. In addition, they must have a good understanding of the principles of robotics and artificial intelligence, as well as knowledge of the hardware and software components of the robot. With this knowledge and expertise, engineers and designers can effectively use the XC2V250-6FG456C chip model in the development of intelligent robots.



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