AMD Xilinx
XC2V250-5FG456C
XC2V250-5FG456C ECAD Model
XC2V250-5FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 200 | |
| Number of Outputs | 200 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V250-5FG456C Datasheet Download
XC2V250-5FG456C Overview
The Xilinx XC2V250-5FG456C Chip Model is a highly advanced, integrated circuit (IC) that is capable of performing a wide range of tasks in the fields of digital signal processing, communications, and networking. It is a high-performance, low-power, and high-density device that can be used in a variety of applications. The XC2V250-5FG456C chip model is a versatile and powerful solution for many industries, and its expected demand is expected to grow steadily in the future.
The XC2V250-5FG456C chip model is capable of supporting a wide range of networks, including Ethernet and Wi-Fi, and can be used in a variety of intelligent scenarios. It can be used for the development of intelligent robots, as it is capable of handling complex tasks such as speech recognition, facial recognition, and natural language processing. It is also capable of being used in the era of fully intelligent systems, as it is capable of handling large amounts of data and providing real-time analysis.
The XC2V250-5FG456C chip model is a powerful tool for the development and popularization of future intelligent robots, as it is capable of handling complex tasks and providing real-time analysis. To use the model effectively, a certain level of technical expertise is required. This includes knowledge of digital signal processing, communications, and networking, as well as experience in programming and debugging. Additionally, knowledge of artificial intelligence (AI) and machine learning (ML) algorithms is also beneficial.
In conclusion, the Xilinx XC2V250-5FG456C Chip Model is a powerful and versatile solution for many industries. It is capable of supporting a wide range of networks and can be used in a variety of intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, and can be used for the development and popularization of future intelligent robots. To use the model effectively, a certain level of technical expertise is required.
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|---|---|---|
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