XC2V1000-6FGG456I
XC2V1000-6FGG456I
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rohs

AMD Xilinx

XC2V1000-6FGG456I


XC2V1000-6FGG456I
F20-XC2V1000-6FGG456I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA456,22X22,40
BGA, BGA456,22X22,40

XC2V1000-6FGG456I ECAD Model


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XC2V1000-6FGG456I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 324
Number of Outputs 324
Number of Logic Cells 11520
Number of Equivalent Gates 1000000
Number of CLBs 1280
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1280 CLBS, 1000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA456,22X22,40
Pin Count 456
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC2V1000-6FGG456I Datasheet Download


XC2V1000-6FGG456I Overview



The XC2V1000-6FGG456I chip model is a high-performance and cost-effective model developed by Xilinx, a leader in the field of programmable logic. It is designed to meet the needs of high-end system applications, such as high-speed data processing and communications, video and image processing, and industrial automation. It has a high-speed transceiver with up to 6.5 Gbps data rate, and a wide range of integrated features, including a large number of configurable logic blocks, high-speed I/O, and advanced memory and DSP resources.


The XC2V1000-6FGG456I chip model is expected to have strong demand in the future, as it is well-suited to the needs of many industries. For example, its high-speed transceiver and configurable logic blocks are ideal for applications such as machine vision, high-speed data processing and communications, and industrial automation. In addition, its advanced memory and DSP resources make it suitable for use in the development of intelligent systems.


The original design intention of the XC2V1000-6FGG456I chip model is to provide a high-performance and cost-effective solution for a variety of applications. It has the potential to be upgraded in the future, as it is designed to be flexible and scalable. For example, its configurable logic blocks can be easily adapted to different applications, and its memory and DSP resources can be expanded to meet the needs of more demanding applications.


The XC2V1000-6FGG456I chip model can be applied to a variety of networks, including 5G and beyond. It is also suitable for use in intelligent scenarios, such as autonomous driving, smart home and industrial automation. In addition, it is capable of being used in the era of fully intelligent systems, as its advanced features make it suitable for use in the development of artificial intelligence and machine learning applications.


Overall, the XC2V1000-6FGG456I chip model is a high-performance and cost-effective solution for a variety of applications. It is expected to have strong demand in the future, as it is well-suited to the needs of many industries. It has the potential to be upgraded in the future, and can be applied to a variety of networks and intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, making it an ideal solution for the development of artificial intelligence and machine learning applications.



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