
AMD Xilinx
XC2V1000-6FGG456I
XC2V1000-6FGG456I ECAD Model
XC2V1000-6FGG456I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 324 | |
Number of Outputs | 324 | |
Number of Logic Cells | 11520 | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 1280 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1280 CLBS, 1000000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA456,22X22,40 | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC2V1000-6FGG456I Datasheet Download
XC2V1000-6FGG456I Overview
The XC2V1000-6FGG456I chip model is a high-performance and cost-effective model developed by Xilinx, a leader in the field of programmable logic. It is designed to meet the needs of high-end system applications, such as high-speed data processing and communications, video and image processing, and industrial automation. It has a high-speed transceiver with up to 6.5 Gbps data rate, and a wide range of integrated features, including a large number of configurable logic blocks, high-speed I/O, and advanced memory and DSP resources.
The XC2V1000-6FGG456I chip model is expected to have strong demand in the future, as it is well-suited to the needs of many industries. For example, its high-speed transceiver and configurable logic blocks are ideal for applications such as machine vision, high-speed data processing and communications, and industrial automation. In addition, its advanced memory and DSP resources make it suitable for use in the development of intelligent systems.
The original design intention of the XC2V1000-6FGG456I chip model is to provide a high-performance and cost-effective solution for a variety of applications. It has the potential to be upgraded in the future, as it is designed to be flexible and scalable. For example, its configurable logic blocks can be easily adapted to different applications, and its memory and DSP resources can be expanded to meet the needs of more demanding applications.
The XC2V1000-6FGG456I chip model can be applied to a variety of networks, including 5G and beyond. It is also suitable for use in intelligent scenarios, such as autonomous driving, smart home and industrial automation. In addition, it is capable of being used in the era of fully intelligent systems, as its advanced features make it suitable for use in the development of artificial intelligence and machine learning applications.
Overall, the XC2V1000-6FGG456I chip model is a high-performance and cost-effective solution for a variety of applications. It is expected to have strong demand in the future, as it is well-suited to the needs of many industries. It has the potential to be upgraded in the future, and can be applied to a variety of networks and intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, making it an ideal solution for the development of artificial intelligence and machine learning applications.
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