AMD Xilinx
XC2V1000-6FG456C
XC2V1000-6FG456C ECAD Model
XC2V1000-6FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 324 | |
| Number of Outputs | 324 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1000-6FG456C Datasheet Download
XC2V1000-6FG456C Overview
The XC2V1000-6FG456C chip model is a versatile and powerful model that is suitable for a wide range of applications. It is widely used in high-performance digital signal processing, embedded processing, image processing, and other related industries. The XC2V1000-6FG456C chip model is designed to be compatible with the HDL language, allowing for efficient and effective programming.
The XC2V1000-6FG456C chip model offers a range of advantages that make it an ideal choice for a variety of industries. It is highly efficient, offering high-speed performance and low power consumption. The model also has a wide range of features, such as advanced memory management, on-chip debugging, and flexible I/O. These features make the XC2V1000-6FG456C chip model an excellent choice for a variety of applications.
The demand for the XC2V1000-6FG456C chip model is expected to continue to grow in the future as the need for high-performance digital signal processing, embedded processing, and image processing increases. The chip model is also expected to be used in the development and popularization of future intelligent robots. To use the XC2V1000-6FG456C chip model effectively, technical talents such as software engineers, hardware engineers, and embedded system engineers are required. These professionals must have a good understanding of the HDL language and be able to write efficient and effective code.
In conclusion, the XC2V1000-6FG456C chip model is an ideal choice for a wide range of applications and is expected to be used in the development and popularization of future intelligent robots. To use the XC2V1000-6FG456C chip model effectively, technical talents such as software engineers, hardware engineers, and embedded system engineers are required. With its wide range of features, the XC2V1000-6FG456C chip model is sure to be a popular choice for many industries in the future.
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1,411 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $404.7360 | $404.7360 |
| 10+ | $400.3840 | $4,003.8400 |
| 100+ | $378.6240 | $37,862.4000 |
| 1000+ | $356.8640 | $178,432.0000 |
| 10000+ | $326.4000 | $326,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||