AMD Xilinx
XC2V1000-4FG456C
XC2V1000-4FG456C ECAD Model
XC2V1000-4FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 324 | |
| Number of Outputs | 324 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1000-4FG456C Datasheet Download
XC2V1000-4FG456C Overview
The XC2V1000-4FG456C chip model is a powerful and versatile integrated circuit that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, so it is important to consider the industry trends and future development of related technologies to ensure that the application environment has the support it needs.
The XC2V1000-4FG456C chip model offers many advantages for its users. It has a high-performance architecture that can handle complex tasks quickly and efficiently. Its power consumption is low, making it an energy-efficient solution for many applications. Additionally, it is designed to be flexible, allowing users to customize the chip to their specific needs.
The XC2V1000-4FG456C chip model is expected to be in high demand in related industries in the future. Its high performance and low power consumption make it a desirable choice for many applications. Additionally, its flexibility and ability to be customized make it a great solution for those who are looking for a chip that can be tailored to their specific needs.
The XC2V1000-4FG456C chip model is a great choice for many applications, and its future demand in related industries is expected to be high. It is important to consider the industry trends and future development of related technologies to ensure that the application environment has the support it needs. Additionally, its advantages, such as its high performance, low power consumption, and flexibility, make it an attractive option for many users.
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1,577 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12.6430 | $12.6430 |
| 10+ | $12.5070 | $125.0703 |
| 100+ | $11.8273 | $1,182.7302 |
| 1000+ | $11.1476 | $5,573.7860 |
| 10000+ | $10.1960 | $10,195.9500 |
| The price is for reference only, please refer to the actual quotation! | ||