AMD Xilinx
XC2C64-7VQ100I
XC2C64-7VQ100I ECAD Model
XC2C64-7VQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, 0.50 MM PITCH, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C64-7VQ100I Datasheet Download
XC2C64-7VQ100I Overview
The XC2C64-7VQ100I chip model is a powerful and versatile integrated circuit designed for use in a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL (Hardware Description Language) language, allowing for the creation of highly optimized and efficient designs.
The XC2C64-7VQ100I chip model is a great choice for applications that require high performance, as it is capable of processing large amounts of data in a short amount of time. Its small size and low power consumption make it ideal for embedded applications, and its ability to interface with external components makes it suitable for a wide range of applications.
The future development of the XC2C64-7VQ100I chip model and related industries will depend on the specific technologies that are needed. In order to make the most of the chip's capabilities, it is important to understand the product description and design requirements, as well as the actual case studies and precautions that should be taken when using the chip.
For those looking to use the XC2C64-7VQ100I chip model, there are a number of resources available to help with the design process. The chip's documentation provides an overview of the chip's features and capabilities, as well as detailed information on the programming language and the design process. Additionally, there are a number of online forums and tutorials that can help with understanding the chip's features and capabilities, as well as troubleshooting any issues that may arise.
In conclusion, the XC2C64-7VQ100I chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications. It is important to understand the product description, design requirements, and actual case studies before using the chip, as well as taking the necessary precautions. Additionally, there are a number of resources available to help with the design process, making the XC2C64-7VQ100I an ideal choice for those looking to take advantage of its features and capabilities.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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