AMD Xilinx
XC2C128-4VQ100C
XC2C128-4VQ100C ECAD Model
XC2C128-4VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 4.5 ns | |
| Number of Macro Cells | 128 | |
| Number of I/O Lines | 80 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 80 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, 0.50 MM PITCH, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C128-4VQ100C Datasheet Download
XC2C128-4VQ100C Overview
The Xilinx XC2C128-4VQ100C is a powerful chip model that offers a wide range of advantages for various industries. It is a high-speed, low-power, and high-performance FPGA that is designed for use in a variety of applications, from networking to automation. Its flexibility and scalability make it an ideal choice for many applications.
The XC2C128-4VQ100C is a versatile chip model that can be used in a variety of industries, including telecom, automotive, industrial, and medical. It is a cost-effective solution that can be used in a wide range of applications, from high-speed data processing to embedded systems. It is also capable of performing complex tasks, such as image processing and machine learning.
The XC2C128-4VQ100C offers a number of features that make it an ideal choice for many applications. It is capable of operating at high speeds and low power consumption, making it suitable for a variety of applications. It is also highly scalable and can be used for a variety of applications, from basic data processing to complex tasks.
The XC2C128-4VQ100C is designed to meet the needs of various industries, including telecom, automotive, industrial, and medical. It is designed to meet the specific requirements of each industry, such as high-speed data processing and embedded systems. It is also highly scalable and can be used for a variety of applications.
In terms of future trends, the XC2C128-4VQ100C is expected to be used more widely in networks and intelligent scenarios. It is capable of performing complex tasks such as image processing and machine learning. It is also expected to be used in the era of fully intelligent systems, where it can be used to automate various processes.
The product description and specific design requirements of the XC2C128-4VQ100C can be found in the product manual. It is important to note that the chip model requires specific design requirements in order to function properly. It is also important to consider actual case studies and precautions when designing for this chip model.
In conclusion, the Xilinx XC2C128-4VQ100C is a powerful chip model that offers a wide range of advantages for various industries. It is a high-speed, low-power, and high-performance FPGA that is designed for use in a variety of applications. It is expected to be used more widely in networks and intelligent scenarios in the future, and can be used to automate various processes in the era of fully intelligent systems. It is important to consider the product description and specific design requirements of the chip model, along with actual case studies and precautions, when designing for this chip model.
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|---|---|---|
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