AMD Xilinx
XC2C512-6FT256C
XC2C512-6FT256C ECAD Model
XC2C512-6FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2C512-6FT256C Datasheet Download
XC2C512-6FT256C Overview
The XC2C512-6FT256C chip model is a powerful and versatile model that is ideal for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that is used to describe the behavior of digital systems. This chip model provides a wide range of features and benefits that make it suitable for these types of applications.
The XC2C512-6FT256C chip model has a number of advantages that make it well-suited for its intended use. It is designed to be highly efficient, allowing for faster processing times and better overall performance. It is also designed to be highly reliable, ensuring that it will remain operational even under the most demanding conditions. This chip model also has a low power consumption, making it an ideal choice for applications that require low power consumption.
The demand for the XC2C512-6FT256C chip model is expected to continue to increase in the future as more industries discover the advantages of the model. It is a versatile model that is suitable for a wide range of applications, and its low power consumption makes it an attractive option for many industries. In addition, its reliability and efficiency make it a popular choice for applications that require a high level of performance.
The original design intention of the XC2C512-6FT256C chip model was to provide a powerful and reliable model that could be used in a variety of applications. It is designed to be highly efficient and reliable, and its low power consumption makes it an ideal choice for a wide range of applications. The chip model is also designed to be easily upgradable, allowing for the addition of new features and capabilities as needed.
The XC2C512-6FT256C chip model is also suitable for use in advanced communication systems. Its low power consumption and high performance make it an ideal choice for applications that require a high level of performance. It is also designed to be easily upgradable, allowing for the addition of new features and capabilities as needed. In addition, its reliability and efficiency make it a popular choice for applications that require a high level of performance.
In conclusion, the XC2C512-6FT256C chip model is a powerful and reliable model that is ideal for high-performance digital signal processing, embedded processing, and image processing. It is designed to be highly efficient and reliable, and its low power consumption makes it an attractive option for many industries. Its upgradability also makes it suitable for use in advanced communication systems. The demand for the XC2C512-6FT256C chip model is expected to continue to increase in the future as more industries discover the advantages of the model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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