AMD Xilinx
XC2C384-6FT256C
XC2C384-6FT256C ECAD Model
XC2C384-6FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2C384-6FT256C Datasheet Download
XC2C384-6FT256C Overview
The XC2C384-6FT256C chip model is a highly advanced and versatile integrated circuit that has been designed to meet the needs of modern technology. It is a powerful and reliable solution for a variety of applications, including networks, intelligent systems, and other electronic devices. The chip model is capable of providing high-speed connectivity, data processing, and memory storage capabilities.
The XC2C384-6FT256C chip model has many advantages, including its low power consumption, high speed performance, and compact design. It is also highly reliable and can be used in a wide range of applications. It is designed to be compatible with a variety of operating systems and platforms, making it suitable for use in a variety of industries.
The XC2C384-6FT256C chip model is expected to be in high demand in the coming years, as the need for reliable and powerful integrated circuits grows. As technology advances, the demand for more powerful and efficient chips will continue to increase. This chip model is also expected to be used in a variety of network and intelligent system applications, as well as in the era of fully intelligent systems.
The XC2C384-6FT256C chip model is designed to meet specific design requirements. It is capable of providing high-speed connectivity, data processing, and memory storage capabilities. It is also designed to be compatible with a variety of operating systems and platforms, making it suitable for use in a variety of industries. The chip model is also capable of providing reliable performance and is highly reliable.
The XC2C384-6FT256C chip model has been used in a variety of applications, including networks, intelligent systems, and other electronic devices. It has been used in a variety of case studies and has been found to be highly reliable and efficient. However, it is important to note that there are certain precautions that should be taken when using this chip model. It is important to ensure that the chip model is compatible with the operating system and platform that it is being used on, as well as any other components that may be connected to it. Additionally, it is important to ensure that the chip model is properly installed and configured in order to ensure optimal performance.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||