AMD Xilinx
XC2C256-5VQG100C
XC2C256-5VQG100C ECAD Model
XC2C256-5VQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 5 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 80 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 80 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, QFP100,.63SQ,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C256-5VQG100C Datasheet Download
XC2C256-5VQG100C Overview
The Xilinx XC2C256-5VQG100C chip model is a highly advanced and powerful device that offers a variety of features and capabilities. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. This chip model has been widely used in both commercial and military applications, and has been praised for its high performance and reliability.
The XC2C256-5VQG100C chip model offers a variety of benefits that make it an ideal choice for a wide range of applications. It features a high speed, low power consumption, and a variety of configurable options. This chip model is also highly reliable and can withstand extreme environmental conditions. Furthermore, it is designed with a modular architecture that allows for easy upgrades and expansions.
The XC2C256-5VQG100C chip model is expected to experience strong demand in the future, as the demand for advanced communication systems continues to grow. This chip model is well-suited for use in a variety of advanced communication systems, including 5G networks, satellite communication systems, and Internet of Things (IoT) systems. Furthermore, this chip model is also expected to be used in the era of fully intelligent systems, as it is capable of handling complex tasks and providing high-level intelligence.
The XC2C256-5VQG100C chip model is also expected to be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and artificial intelligence. This chip model is designed to be highly reliable and can handle complex tasks with ease. Furthermore, it is capable of providing high-level intelligence, which is essential for the development of fully intelligent systems.
In conclusion, the XC2C256-5VQG100C chip model is a highly advanced and powerful device that offers a variety of features and capabilities. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. This chip model is expected to experience strong demand in the future, as the demand for advanced communication systems continues to grow. Furthermore, it is expected to be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and artificial intelligence.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||