AMD Xilinx
XC2C256-5VQ100C
XC2C256-5VQ100C ECAD Model
XC2C256-5VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 5 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 80 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 80 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, QFP100,.63SQ,20 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C256-5VQ100C Datasheet Download
XC2C256-5VQ100C Overview
The Xilinx XC2C256-5VQ100C chip is a high-performance device designed to meet the needs of digital signal processing, embedded processing, image processing and other applications. It is an advanced, high-speed, low-power device that uses the HDL language for programming. The XC2C256-5VQ100C has many advantages over other chips, including its large capacity, high speed, low power consumption, and its ability to support multiple operating systems. It is also designed with a wide range of features, including a high-speed register file, an embedded processor, and an FPGA.
The XC2C256-5VQ100C is an ideal choice for a variety of industries, including aerospace, automotive, medical, and telecommunications. The chip is suitable for high-performance applications, such as digital signal processing, image processing, and embedded systems. It is also a great choice for advanced communication systems, as it is designed to support a wide range of communication protocols, including GSM, CDMA, and UMTS.
The XC2C256-5VQ100C is designed to be highly scalable and can be upgraded to meet the changing needs of its users. It is also designed to be future-proof, allowing it to be used in more advanced applications in the future. The chip is also designed to be highly reliable, with a low failure rate and a long lifetime. This makes it an ideal choice for long-term use in mission-critical applications.
Overall, the Xilinx XC2C256-5VQ100C is an excellent choice for a variety of applications. It is designed to be highly reliable, scalable, and future-proof, making it an ideal choice for a wide range of industries. Furthermore, it is highly suitable for use in advanced communication systems, making it a great choice for those looking to stay ahead of the curve.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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