AMD Xilinx
XC17S50XLSO20I
XC17S50XLSO20I ECAD Model
XC17S50XLSO20I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 559.232 kbit | |
| Memory Width | 1 | |
| Organization | 559232X1 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 10 MHz | |
| Memory IC Type | MEMORY CIRCUIT | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 559232 | |
| Number of Words | 559.232 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 5 µA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PDSO-G20 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 20 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP20,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 2.65 mm | |
| Length | 12.8 mm | |
| Width | 7.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP20,.4 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 |
XC17S50XLSO20I Datasheet Download
XC17S50XLSO20I Overview
The XC17S50XLSO20I is a revolutionary chip model that has been developed to meet the needs of modern technology. This chip model is a high-performance, low-power, low-cost solution that can be used in a wide range of applications. It is designed to provide reliable and efficient performance in both industrial and consumer applications.
The XC17S50XLSO20I has a number of advantages over other chip models. It supports a wide range of operating frequencies, and its power efficiency is significantly higher than other models. In addition, it is designed to be compatible with a variety of communication protocols, including Bluetooth, Wi-Fi, and Zigbee. It also has a powerful on-chip memory and a wide range of peripheral devices, making it suitable for a variety of applications.
The XC17S50XLSO20I is expected to be in high demand in the future, particularly in the area of advanced communication systems. This chip model has been designed to meet the needs of these systems, and its features are ideal for use in a wide range of applications. Its power efficiency and compatibility with a variety of communication protocols make it an ideal choice for these systems.
The original design intention of the XC17S50XLSO20I was to provide a reliable and efficient solution for a wide range of applications. It is designed to be compatible with a variety of communication protocols, and its power efficiency is significantly higher than other models. It also has a powerful on-chip memory and a wide range of peripheral devices, making it suitable for a variety of applications.
The XC17S50XLSO20I is also designed to be upgradeable, allowing for future upgrades and improvements. It is designed to be compatible with a variety of communication protocols, making it suitable for use in advanced communication systems. It also has a powerful on-chip memory and a wide range of peripheral devices, making it suitable for a variety of applications.
The product description and specific design requirements of the XC17S50XLSO20I are as follows: it is a high-performance, low-power, low-cost solution that can be used in a wide range of applications. It is designed to be compatible with a variety of communication protocols, including Bluetooth, Wi-Fi, and Zigbee. It also has a powerful on-chip memory and a wide range of peripheral devices, making it suitable for a variety of applications.
In addition, actual case studies and precautions should be taken into consideration when using the XC17S50XLSO20I. It is important to ensure that the chip model is compatible with the intended application, as well as any other devices that may be connected to it. It is also important to ensure that the chip model is properly configured to ensure optimal performance. Finally, it is important to follow the manufacturer’s instructions for proper maintenance and handling of the chip model.
In conclusion, the XC17S50XLSO20I is a revolutionary chip model that has been developed to meet the needs of modern technology. It has a number of advantages over other chip models, and is expected to be in high demand in the future. It is designed to be compatible with a variety of communication protocols, and its power efficiency is significantly higher than other models. The product description and specific design requirements of the XC17S50XLSO20I, along with actual case studies and precautions, should be taken into consideration when using this chip model.
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