
AMD Xilinx
XC17S50XLSO20C
XC17S50XLSO20C ECAD Model
XC17S50XLSO20C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 559.232 kbit | |
Memory Width | 1 | |
Organization | 559232X1 | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Power Supplies | 3.3 V | |
Clock Frequency-Max (fCLK) | 10 MHz | |
Memory IC Type | MEMORY CIRCUIT | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 559232 | |
Number of Words | 559.232 k | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Standby Current-Max | 50 µA | |
Supply Current-Max | 5 µA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-PDSO-G20 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 20 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP20,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 2.65 mm | |
Length | 12.8 mm | |
Width | 7.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | SOIC | |
Package Description | SOP, SOP20,.4 | |
Pin Count | 20 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 |
XC17S50XLSO20C Datasheet Download
XC17S50XLSO20C Overview
The XC17S50XLSO20C chip model is an advanced integrated circuit that has been designed to meet the needs of the modern electronics industry. It is a high-performance, low-power, and cost-effective model that is suitable for a wide range of applications. The XC17S50XLSO20C chip model is one of the most popular models in the industry and is expected to experience increasing demand in the future.
The XC17S50XLSO20C chip model is a Field Programmable Gate Array (FPGA) with a wide range of features and capabilities. It is designed to be used in a variety of applications such as digital signal processing, embedded systems, and communications. The XC17S50XLSO20C chip model is capable of supporting up to 50,000 logic cells, which can be used to implement complex designs. It also has a wide range of I/O capabilities, including up to 20 high-speed transceivers, and up to 32 dedicated differential pairs.
The XC17S50XLSO20C chip model has been used in a variety of applications, including the development of automotive systems, medical devices, and industrial automation systems. In addition, it has been used in the development of robots and other intelligent systems. In order to use the XC17S50XLSO20C chip model effectively, it is important to have a good understanding of the FPGA technology, as well as the design principles and techniques associated with it. It is also important to have a good understanding of the chip's features and capabilities, as well as the development tools available for the model.
When using the XC17S50XLSO20C chip model, there are a few important precautions that should be taken. It is important to ensure that the chip is properly cooled and that it is not exposed to any excessive heat or vibration. It is also important to ensure that the chip is properly connected to the power supply, as this can affect the performance of the chip.
The XC17S50XLSO20C chip model can be applied to the development and popularization of future intelligent robots. This chip model has the necessary features and capabilities to be used in the development of robots and other intelligent systems. In order to use the XC17S50XLSO20C chip model effectively, it is important to have a good understanding of the FPGA technology, as well as the design principles and techniques associated with it. It is also important to have a good understanding of the development tools available for the model. Technical skills such as programming, system design, and circuit design are necessary in order to use the XC17S50XLSO20C chip model effectively.
The XC17S50XLSO20C chip model is a powerful and cost-effective model that can be used in a variety of applications. It has the necessary features and capabilities to be used in the development of robots and other intelligent systems. In order to use the XC17S50XLSO20C chip model effectively, it is important to have a good understanding of the FPGA technology, as well as the design principles and techniques associated with it. Technical skills such as programming, system design, and circuit design are necessary in order to use the XC17S50XLSO20C chip model effectively. The XC17S50XLSO20C chip model is expected to experience increasing demand in the future, and it is a great choice for those looking to develop and popularize future intelligent robots.
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