
AMD Xilinx
XAZU3EG-L1SFVA625I
XAZU3EG-L1SFVA625I ECAD Model
XAZU3EG-L1SFVA625I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | S-PBGA-B625 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 625 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.43 mm | |
Width | 21 mm | |
Length | 21 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-625 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XAZU3EG-L1SFVA625I Datasheet Download
XAZU3EG-L1SFVA625I Overview
The chip model XAZU3EG-L1SFVA625I is a powerful and versatile option for a variety of applications. It is a highly advanced system-on-chip (SoC) that combines multiple components into a single integrated circuit, providing a great deal of flexibility and scalability. This chip model is designed to offer a wide range of features and capabilities, including high-speed data transfer, low power consumption, and advanced security.
The XAZU3EG-L1SFVA625I chip model is expected to experience a surge in demand in the near future, as it is well-suited for a variety of applications in the fields of networking, artificial intelligence, and robotics. This model is particularly well-suited for networking applications, as it is capable of high-speed data transfer and low power consumption. Furthermore, this model is well-suited for artificial intelligence applications, as it can be used to create systems that can learn and adapt to changing environments. Finally, this model is also a great choice for robotics applications, as it is capable of providing high-speed data transfer, low power consumption, and advanced security.
The chip model XAZU3EG-L1SFVA625I has the potential to be used in the era of fully intelligent systems. This model is well-suited for use in intelligent robots, as it can provide the necessary computing power and data transfer capabilities to enable robots to perform complex tasks. In order to use this model effectively, a variety of technical talents are needed, such as software engineers, data scientists, and roboticists. Additionally, this model can be used to develop and popularize future intelligent robots, as it is capable of providing the necessary computing power and data transfer capabilities.
In conclusion, the chip model XAZU3EG-L1SFVA625I is a powerful and versatile option for a variety of applications. It is expected to experience a surge in demand in the near future, as it is well-suited for a variety of applications in the fields of networking, artificial intelligence, and robotics. This model has the potential to be used in the era of fully intelligent systems and can be used to develop and popularize future intelligent robots. In order to use this model effectively, a variety of technical talents are needed, such as software engineers, data scientists, and roboticists.
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4,609 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $450.7152 | $450.7152 |
10+ | $445.8688 | $4,458.6880 |
100+ | $421.6368 | $42,163.6800 |
1000+ | $397.4048 | $198,702.4000 |
10000+ | $363.4800 | $363,480.0000 |
The price is for reference only, please refer to the actual quotation! |