XAZU3EG-L1SFVA625I
XAZU3EG-L1SFVA625I
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rohs

AMD Xilinx

XAZU3EG-L1SFVA625I


XAZU3EG-L1SFVA625I
F20-XAZU3EG-L1SFVA625I
Active
CMOS, FCBGA-625
FCBGA-625

XAZU3EG-L1SFVA625I ECAD Model


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XAZU3EG-L1SFVA625I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade INDUSTRIAL
JESD-30 Code S-PBGA-B625
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 625
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 3.43 mm
Width 21 mm
Length 21 mm
Ihs Manufacturer XILINX INC
Package Description FCBGA-625
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XAZU3EG-L1SFVA625I Datasheet Download


XAZU3EG-L1SFVA625I Overview



The chip model XAZU3EG-L1SFVA625I is a powerful and versatile option for a variety of applications. It is a highly advanced system-on-chip (SoC) that combines multiple components into a single integrated circuit, providing a great deal of flexibility and scalability. This chip model is designed to offer a wide range of features and capabilities, including high-speed data transfer, low power consumption, and advanced security.


The XAZU3EG-L1SFVA625I chip model is expected to experience a surge in demand in the near future, as it is well-suited for a variety of applications in the fields of networking, artificial intelligence, and robotics. This model is particularly well-suited for networking applications, as it is capable of high-speed data transfer and low power consumption. Furthermore, this model is well-suited for artificial intelligence applications, as it can be used to create systems that can learn and adapt to changing environments. Finally, this model is also a great choice for robotics applications, as it is capable of providing high-speed data transfer, low power consumption, and advanced security.


The chip model XAZU3EG-L1SFVA625I has the potential to be used in the era of fully intelligent systems. This model is well-suited for use in intelligent robots, as it can provide the necessary computing power and data transfer capabilities to enable robots to perform complex tasks. In order to use this model effectively, a variety of technical talents are needed, such as software engineers, data scientists, and roboticists. Additionally, this model can be used to develop and popularize future intelligent robots, as it is capable of providing the necessary computing power and data transfer capabilities.


In conclusion, the chip model XAZU3EG-L1SFVA625I is a powerful and versatile option for a variety of applications. It is expected to experience a surge in demand in the near future, as it is well-suited for a variety of applications in the fields of networking, artificial intelligence, and robotics. This model has the potential to be used in the era of fully intelligent systems and can be used to develop and popularize future intelligent robots. In order to use this model effectively, a variety of technical talents are needed, such as software engineers, data scientists, and roboticists.



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Unit Price: $484.64
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $450.7152 $450.7152
10+ $445.8688 $4,458.6880
100+ $421.6368 $42,163.6800
1000+ $397.4048 $198,702.4000
10000+ $363.4800 $363,480.0000
The price is for reference only, please refer to the actual quotation!

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