
AMD Xilinx
XAZU3EG-1SFVA625Q
XAZU3EG-1SFVA625Q ECAD Model
XAZU3EG-1SFVA625Q Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
JESD-30 Code | S-PBGA-B625 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 625 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.43 mm | |
Width | 21 mm | |
Length | 21 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-625 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XAZU3EG-1SFVA625Q Datasheet Download
XAZU3EG-1SFVA625Q Overview
The XAZU3EG-1SFVA625Q chip model is a revolutionary development in the field of advanced communication systems. It has been designed to meet the needs of modern applications and provide an efficient and effective solution for many of the challenges faced by developers. It is a powerful tool for creating robust communication systems and is capable of supporting a variety of different solutions.
The original design intention of the XAZU3EG-1SFVA625Q chip model was to provide a comprehensive solution for modern communication systems. It was designed to be able to support a wide range of applications, including high-speed data transmission, secure communication, and support for advanced features such as voice and video services. It also provides a flexible platform for further development and upgrades, allowing developers to easily add new features and capabilities to their systems.
The XAZU3EG-1SFVA625Q chip model has been designed to be used in a variety of different contexts. It is suitable for use in both commercial and industrial applications, and can be used as a core component in a variety of communication systems. It supports a wide range of protocols and can be used to create secure and reliable communication networks, as well as providing a platform for further development.
The XAZU3EG-1SFVA625Q chip model can also be used to develop and popularize future intelligent robots. It is capable of supporting a variety of different functions, including data processing, navigation, and communication. It is also capable of providing the necessary resources for the development of more complex and advanced robots, such as those that are capable of autonomous operation.
In order to use the XAZU3EG-1SFVA625Q chip model effectively, it is important to understand the product description and specific design requirements. It is also important to consider any potential pitfalls and to take into account any potential upgrades that may be needed. Additionally, it is important to ensure that the model is compatible with other components and systems.
In conclusion, the XAZU3EG-1SFVA625Q chip model is a powerful and versatile tool for creating advanced communication systems and for developing and popularizing future intelligent robots. It is important to understand the product description and specific design requirements, as well as any potential upgrades or compatibility issues. Additionally, it is important to have the necessary technical expertise to use the model effectively.
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5,474 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $450.7152 | $450.7152 |
10+ | $445.8688 | $4,458.6880 |
100+ | $421.6368 | $42,163.6800 |
1000+ | $397.4048 | $198,702.4000 |
10000+ | $363.4800 | $363,480.0000 |
The price is for reference only, please refer to the actual quotation! |