XAZU3EG-1SFVA625Q
XAZU3EG-1SFVA625Q
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rohs

AMD Xilinx

XAZU3EG-1SFVA625Q


XAZU3EG-1SFVA625Q
F20-XAZU3EG-1SFVA625Q
Active
CMOS, FCBGA-625
FCBGA-625

XAZU3EG-1SFVA625Q ECAD Model


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XAZU3EG-1SFVA625Q Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade AUTOMOTIVE
JESD-30 Code S-PBGA-B625
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 625
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 3.43 mm
Width 21 mm
Length 21 mm
Ihs Manufacturer XILINX INC
Package Description FCBGA-625
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XAZU3EG-1SFVA625Q Datasheet Download


XAZU3EG-1SFVA625Q Overview



The XAZU3EG-1SFVA625Q chip model is a revolutionary development in the field of advanced communication systems. It has been designed to meet the needs of modern applications and provide an efficient and effective solution for many of the challenges faced by developers. It is a powerful tool for creating robust communication systems and is capable of supporting a variety of different solutions.


The original design intention of the XAZU3EG-1SFVA625Q chip model was to provide a comprehensive solution for modern communication systems. It was designed to be able to support a wide range of applications, including high-speed data transmission, secure communication, and support for advanced features such as voice and video services. It also provides a flexible platform for further development and upgrades, allowing developers to easily add new features and capabilities to their systems.


The XAZU3EG-1SFVA625Q chip model has been designed to be used in a variety of different contexts. It is suitable for use in both commercial and industrial applications, and can be used as a core component in a variety of communication systems. It supports a wide range of protocols and can be used to create secure and reliable communication networks, as well as providing a platform for further development.


The XAZU3EG-1SFVA625Q chip model can also be used to develop and popularize future intelligent robots. It is capable of supporting a variety of different functions, including data processing, navigation, and communication. It is also capable of providing the necessary resources for the development of more complex and advanced robots, such as those that are capable of autonomous operation.


In order to use the XAZU3EG-1SFVA625Q chip model effectively, it is important to understand the product description and specific design requirements. It is also important to consider any potential pitfalls and to take into account any potential upgrades that may be needed. Additionally, it is important to ensure that the model is compatible with other components and systems.


In conclusion, the XAZU3EG-1SFVA625Q chip model is a powerful and versatile tool for creating advanced communication systems and for developing and popularizing future intelligent robots. It is important to understand the product description and specific design requirements, as well as any potential upgrades or compatibility issues. Additionally, it is important to have the necessary technical expertise to use the model effectively.



5,474 In Stock


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Unit Price: $484.64
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $450.7152 $450.7152
10+ $445.8688 $4,458.6880
100+ $421.6368 $42,163.6800
1000+ $397.4048 $198,702.4000
10000+ $363.4800 $363,480.0000
The price is for reference only, please refer to the actual quotation!

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