AMD Xilinx
XAZU3EG-1SFVA625I
XAZU3EG-1SFVA625I ECAD Model
XAZU3EG-1SFVA625I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 625 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.43 mm | |
| Width | 21 mm | |
| Length | 21 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-625 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XAZU3EG-1SFVA625I Datasheet Download
XAZU3EG-1SFVA625I Overview
The XAZU3EG-1SFVA625I chip model is an advanced processor designed for high-performance digital signal processing, embedded processing, image processing and other applications. It is designed to be used with a high-level hardware description language (HDL) for programming. The original design intention of the chip was to provide a powerful and reliable processor for use in high-performance applications. The chip has the potential for future upgrades that can make it even more powerful and reliable.
The XAZU3EG-1SFVA625I chip model is designed to meet the specific requirements of advanced communication systems. It is equipped with a wide range of features, including a powerful processor, a high-speed memory, and a wide range of I/O options. It also has the ability to support multiple operating systems, as well as a variety of programming languages. This makes it ideal for use in a variety of applications.
The product description and design requirements of the XAZU3EG-1SFVA625I chip model are detailed in the product documentation. It is important to read the documentation carefully before using the chip model. Additionally, it is important to consider actual case studies and precautions when using the chip model. This will help ensure that the chip model is used correctly and safely.
Overall, the XAZU3EG-1SFVA625I chip model is a powerful and reliable processor that is suitable for use in high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with a high-level hardware description language (HDL) for programming. The product description and design requirements of the chip model are detailed in the product documentation, and it is important to consider actual case studies and precautions when using the chip model.
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3,196 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,724.7715 | $1,724.7715 |
| 10+ | $1,706.2256 | $17,062.2556 |
| 100+ | $1,613.4959 | $161,349.5910 |
| 1000+ | $1,520.7663 | $760,383.1300 |
| 10000+ | $1,390.9448 | $1,390,944.7500 |
| The price is for reference only, please refer to the actual quotation! | ||