AMD Xilinx
XAZU2EG-L1SFVA625I
XAZU2EG-L1SFVA625I ECAD Model
XAZU2EG-L1SFVA625I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 625 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.43 mm | |
| Width | 21 mm | |
| Length | 21 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-625 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XAZU2EG-L1SFVA625I Datasheet Download
XAZU2EG-L1SFVA625I Overview
The chip model XAZU2EG-L1SFVA625I is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other demanding applications. It is designed to be used with HDL language, allowing for a more efficient and reliable design process.
The original design intention of the chip model XAZU2EG-L1SFVA625I was to provide a cost-effective solution for complex computing applications. It is designed to be easily upgradable and can be used in advanced communication systems. With its powerful processing capabilities, it can be used in a variety of intelligent scenarios such as machine learning, artificial intelligence, and natural language processing.
The chip model XAZU2EG-L1SFVA625I is also suitable for use in networks and can be used to create intelligent systems. It can be used to process large amounts of data quickly and accurately. This makes it an ideal solution for the era of fully intelligent systems. It can be used to develop and deploy advanced applications such as autonomous driving, smart cities, and IoT networks.
The chip model XAZU2EG-L1SFVA625I is a powerful integrated circuit that can be used for a variety of applications. Its original design intention was to provide a cost-effective solution for complex computing applications. It is also upgradable and can be used in advanced communication systems. It is suitable for use in networks and can be used to create intelligent systems. This makes it an ideal solution for the era of fully intelligent systems and can be used to develop and deploy advanced applications.
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2,118 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $289.1928 | $289.1928 |
| 10+ | $286.0832 | $2,860.8320 |
| 100+ | $270.5352 | $27,053.5200 |
| 1000+ | $254.9872 | $127,493.6000 |
| 10000+ | $233.2200 | $233,220.0000 |
| The price is for reference only, please refer to the actual quotation! | ||