Microchip Technology Inc
AGLP125V2-CSG281I
AGLP125V2-CSG281I ECAD Model
AGLP125V2-CSG281I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 212 | |
| Number of Outputs | 212 | |
| Number of Logic Cells | 3120 | |
| Number of Equivalent Gates | 125000 | |
| Number of CLBs | 3120 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3120 CLBS, 125000 GATES | |
| Clock Frequency-Max | 160 MHz | |
| Power Supplies | 1.2/1.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B281 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 281 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA281,19X19,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.05 mm | |
| Ihs Manufacturer | MICROSEMI SOC PRODUCTS GROUP | |
| Package Description | TFBGA, BGA281,19X19,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 281 |
AGLP125V2-CSG281I Datasheet Download
AGLP125V2-CSG281I Overview
The AGLP125V2-CSG281I is a low-power, low-voltage, integrated circuit (IC) chip designed for use in battery-powered applications. It is a single-chip solution for a variety of applications, including digital signal processing (DSP), wireless communications, and power management. The chip is based on a 32-bit ARM Cortex-M0 processor core and includes a range of peripherals, such as a 10-bit ADC, two UARTs, four SPI/I2C, two CAN, and two I2S interfaces.
The AGLP125V2-CSG281I is a highly integrated, low-power solution that requires only a single 3.3V power supply and operates at up to 1.2V. It is designed to be used in a wide range of applications, including wireless communication, home automation, wearables, medical devices, and automotive applications.
The AGLP125V2-CSG281I features a low power consumption of only 0.5 mA/MHz and is capable of running at up to 48 MHz. It also offers excellent ESD protection, with a robust 4KV HBM rating. The chip also has a wide operating temperature range of -40 to +85 °C.
The AGLP125V2-CSG281I is an ideal solution for low-power, low-voltage applications. It is a highly integrated, low-power solution that is suitable for a wide range of applications, including wireless communication, home automation, wearables, medical devices, and automotive applications.
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3,115 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2.7900 | $2.7900 |
| 10+ | $2.7600 | $27.6000 |
| 100+ | $2.6100 | $261.0000 |
| 1000+ | $2.4600 | $1,230.0000 |
| 10000+ | $2.2500 | $2,250.0000 |
| The price is for reference only, please refer to the actual quotation! | ||