Intel Corporation
EPF8452ATC100-3N
EPF8452ATC100-3N ECAD Model
EPF8452ATC100-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 68 | |
| Number of Outputs | 68 | |
| Number of Logic Cells | 336 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 78 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 78 I/O | |
| Additional Feature | 336 LOGIC ELEMENTS | |
| Clock Frequency-Max | 385 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, TQFP100,.63SQ | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF8452ATC100-3N Datasheet Download
EPF8452ATC100-3N Overview
The chip model EPF8452ATC100-3N is a powerful and versatile solution for high-performance digital signal processing, embedded processing and image processing. It is designed to enable developers to create complex applications using the HDL language.
The industry trends in chip model EPF8452ATC100-3N have been driven by the need for increased performance, more efficient power consumption and smaller form factors. This has led to the development of new technologies such as advanced lithography, advanced packaging, and advanced system-on-chip (SoC) design.
The original design intention of the chip model EPF8452ATC100-3N was to provide a highly efficient and powerful solution for digital signal processing, embedded processing and image processing applications. It has the potential for future upgrades, such as the integration of new technologies and the addition of features like advanced communication systems.
The application environment of the chip model EPF8452ATC100-3N requires the support of new technologies in order to achieve the desired performance. These technologies include advanced lithography, advanced packaging, and advanced system-on-chip (SoC) design.
The chip model EPF8452ATC100-3N is an excellent solution for high-performance digital signal processing, embedded processing and image processing applications. It has the potential for future upgrades, and its application environment requires the support of new technologies in order to achieve the desired performance. As the industry trends in chip model EPF8452ATC100-3N continue to evolve, it is likely that future upgrades and new technologies will be needed in order to keep up with the ever-changing demands of the industry.
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5,014 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $19.7599 | $19.7599 |
| 10+ | $19.5474 | $195.4742 |
| 100+ | $18.4851 | $1,848.5064 |
| 1000+ | $17.4227 | $8,711.3520 |
| 10000+ | $15.9354 | $15,935.4000 |
| The price is for reference only, please refer to the actual quotation! | ||