Intel Corporation
EPF8452ATC100-2
EPF8452ATC100-2 ECAD Model
EPF8452ATC100-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 68 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 336 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 78 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 78 I/O | |
| Additional Feature | 336 LOGIC ELEMENTS | |
| Clock Frequency-Max | 417 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, TQFP100,.63SQ | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF8452ATC100-2 Datasheet Download
EPF8452ATC100-2 Overview
The chip model EPF8452ATC100-2 is a high-performance and versatile chip model that is suitable for various applications, such as high-performance digital signal processing, embedded processing, image processing, and more. This chip model is capable of performing complex tasks with its powerful and efficient architecture, and it requires the use of HDL language.
The EPF8452ATC100-2 has several advantages that make it a desirable choice for many applications. It is a highly integrated chip model that offers high performance, low power consumption, and cost-effectiveness. It also has a wide range of operating frequencies, making it suitable for a variety of applications. Additionally, it has a wide range of memory options, allowing for greater flexibility and scalability.
The demand for the EPF8452ATC100-2 is expected to grow in the future, as more and more applications require its features. With the increasing demand for faster and more efficient processing, the chip model is likely to become even more popular. Additionally, with the development of new technologies, such as artificial intelligence and the Internet of Things, the demand for high-performance chips such as the EPF8452ATC100-2 is likely to increase.
The EPF8452ATC100-2 is likely to be used in many network applications in the future. It is well-suited for applications such as wireless networking, data centers, and storage systems. Additionally, it can be used in intelligent scenarios, such as autonomous vehicles, robotics, and medical imaging. As technology advances, the chip model may also be used in fully intelligent systems, such as smart homes and smart cities.
In conclusion, the EPF8452ATC100-2 is a powerful and versatile chip model that is suitable for a wide range of applications. It offers high performance, low power consumption, and cost-effectiveness. Additionally, its demand is expected to increase in the future as more and more applications require its features. Finally, it is likely to be used in many network applications, as well as intelligent scenarios, and it may even be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||