EPF6024AQC208-2N
EPF6024AQC208-2N
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Intel Corporation

EPF6024AQC208-2N


EPF6024AQC208-2N
F18-EPF6024AQC208-2N
Active
IC FPGA 171 I/O 208QFP
208-PQFP (28x28)

EPF6024AQC208-2N ECAD Model


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EPF6024AQC208-2N Attributes


Type Description Select
Mfr Intel
Series FLEX 6000
Package Tray
Number of LABs/CLBs 196
Number of Logic Elements/Cells 1960
Number of I/O 171
Number of Gates 24000
Voltage - Supply 3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)
Base Product Number EPF6024

EPF6024AQC208-2N Datasheet Download


EPF6024AQC208-2N Overview



The EPF6024AQC208-2N is an integrated circuit (IC) designed by Altera Corporation. It is a low-cost, low-power, high-performance Field Programmable Gate Array (FPGA) that is suitable for a variety of applications.


The EPF6024AQC208-2N is a low-cost, low-power, high-performance FPGA that is optimized for low-power applications. It features a total of 208 I/O pins, including 144 dedicated I/O pins, 36 dedicated clock pins, and 28 dedicated configuration pins. It also has a total of 8192 logic elements, including 6144 logic elements, 1024 memory elements, and 1024 DSP blocks. The device is packaged in a 208-pin, 14mm x 14mm, QFP package.


The EPF6024AQC208-2N is suitable for a variety of applications, such as automotive, industrial, consumer, and medical. It can be used for general-purpose FPGA applications, such as digital signal processing, embedded control, system-on-chip integration, and high-speed communications. It is also suitable for low-power applications, such as battery-powered systems, portable devices, and wearable electronics.


In summary, the EPF6024AQC208-2N is a low-cost, low-power, high-performance FPGA that is suitable for a variety of applications. It features a total of 208 I/O pins, 8192 logic elements, and is packaged in a 208-pin, 14mm x 14mm, QFP package. It is suitable for general-purpose FPGA applications, such as digital signal processing, embedded control, and system-on-chip integration, as well as low-power applications, such as battery-powered systems, portable devices, and wearable electronics.



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