Intel Corporation
EPF10K10AQC208-1
EPF10K10AQC208-1 ECAD Model
EPF10K10AQC208-1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 134 | |
| Number of Outputs | 134 | |
| Number of Logic Cells | 576 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 134 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 134 I/O | |
| Additional Feature | 576 LOGIC ELEMENTS; 72 LABS | |
| Clock Frequency-Max | 80 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF10K10AQC208-1 Overview
The chip model EPF10K10AQC208-1 is a high-performance programmable logic device (PLD) designed by Altera Corporation. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model offers a wide range of features and capabilities, including a large capacity, high-speed performance, and low power consumption.
The EPF10K10AQC208-1 has several advantages over other PLDs on the market. For example, it has a larger capacity and higher speed performance than other PLDs, which makes it suitable for applications that require more complex computations. Additionally, its low power consumption makes it a great choice for applications that require long-term, continuous operation.
The EPF10K10AQC208-1 is expected to be increasingly in demand in the future. This is due to the growing number of applications that require high-performance digital signal processing, embedded processing, and image processing, as well as the increasing demand for PLDs with large capacities and high-speed performance.
The EPF10K10AQC208-1 can be applied in networks to facilitate communication and data transfer. It can also be used in intelligent scenarios, such as autonomous vehicles, facial recognition, and natural language processing. In the era of fully intelligent systems, this chip model is expected to be used in a variety of applications, including robotics, artificial intelligence, and machine learning.
In conclusion, the EPF10K10AQC208-1 is a powerful and versatile chip model that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and networks. It is expected to be increasingly in demand in the future, and its applications in intelligent scenarios and in the era of fully intelligent systems are expected to be even more extensive.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||