Intel Corporation
EPF10K50SQC208-2X
EPF10K50SQC208-2X ECAD Model
EPF10K50SQC208-2X Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 400 ps | |
| Number of Inputs | 147 | |
| Number of Outputs | 147 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 147 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 147 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | 30.60 X 30.60 MM, 0.50 MM PITCH, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50SQC208-2X Overview
The chip model EPF10K50SQC208-2X is a product of the semiconductor industry, and it has been widely used in many application fields. It is a field-programmable gate array (FPGA) chip with a high integration level and low power consumption. It is widely used in digital signal processing, communications, industrial control, and other fields.
The industry trends of the chip model EPF10K50SQC208-2X are constantly changing. With the development of new technologies, the chip model EPF10K50SQC208-2X is being upgraded and improved in order to meet the requirements of the application environment. In the future, the chip model EPF10K50SQC208-2X will be able to support more advanced technologies.
The original design intention of the chip model EPF10K50SQC208-2X was to provide a low-cost, low-power, and high-integration solution for various applications. With the development of new technologies, the chip model EPF10K50SQC208-2X can be upgraded and improved to meet the requirements of the application environment. In the future, the chip model EPF10K50SQC208-2X will be able to support more advanced technologies and provide better performance.
The possible future applications of the chip model EPF10K50SQC208-2X in networks are numerous. It can be used in various intelligent scenarios, such as intelligent transportation, intelligent manufacturing, and intelligent medical. With the development of the Internet of Things (IoT) and 5G communication technology, the chip model EPF10K50SQC208-2X will be able to provide better performance and more reliable connection in the era of fully intelligent systems.
In conclusion, the chip model EPF10K50SQC208-2X is a product of the semiconductor industry, and it has been widely used in many application fields. With the development of new technologies, the chip model EPF10K50SQC208-2X can be upgraded and improved to meet the requirements of the application environment. In the future, the chip model EPF10K50SQC208-2X will be able to support more advanced technologies and provide better performance in various intelligent scenarios. Therefore, the chip model EPF10K50SQC208-2X will be an important part of the future fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||