
Intel Corporation
EPF10K50SBC356-1X
EPF10K50SBC356-1X ECAD Model
EPF10K50SBC356-1X Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 300 ps | |
Number of Inputs | 220 | |
Number of Outputs | 220 | |
Number of Logic Cells | 2880 | |
Number of I/O Lines | 220 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 220 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B356 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 356 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA356,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.63 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1.27 MM PITCH, BGA-356 | |
Pin Count | 356 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPF10K50SBC356-1X Overview
The chip model EPF10K50SBC356-1X is a powerful and advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. This model is powered by a high-performance Field Programmable Gate Array (FPGA) and requires the use of HDL language for programming.
The EPF10K50SBC356-1X chip model provides a wide range of advantages to users, including high-speed processing, low power consumption, and flexibility in design. It also offers a variety of features, such as high-speed I/O, embedded memory, and multiple clock domains. This model is especially suitable for applications that require high-speed data processing, such as image processing, video processing, and audio processing.
The demand for the EPF10K50SBC356-1X chip model is expected to increase in the coming years, especially in industries that require high-performance digital signal processing. This is due to the increasing demand for faster and more efficient data processing. In addition, this model is also suitable for applications that require flexibility in design, such as embedded systems and industrial automation.
The product description of the EPF10K50SBC356-1X chip model includes its various features and specifications. It has an FPGA operating at 250MHz, a total of 10,000 logic cells, and a maximum of 8,000 embedded RAM blocks. It also has two banks of 256-bit wide block RAMs and two banks of 72-bit wide distributed RAMs. The chip model also has a total of 56 dedicated I/O pins, four high-speed transceivers, and two high-speed serializers.
In terms of design, the EPF10K50SBC356-1X chip model requires the use of HDL language for programming. This language is used to define the internal structure of the chip, such as the logic gates, multiplexers, and other components. It also allows for the easy customization of the chip for different applications.
To illustrate the use of the EPF10K50SBC356-1X chip model, a case study of an image processing application is presented. In this application, the chip model is used to capture images from a camera and process them in real-time. The chip model is programmed using HDL language to define the logic gates and multiplexers, and to configure the embedded memory blocks.
When using the EPF10K50SBC356-1X chip model, it is important to take into consideration the power consumption and the temperature of the device. If the device is exposed to high temperatures, it may cause damage to the chip. Therefore, it is important to ensure that the device is kept in a cool and dry environment.
In conclusion, the EPF10K50SBC356-1X chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It provides users with a wide range of advantages, such as high-speed processing, low power consumption, and flexibility in design. Its demand is expected to increase in the coming years due to the increasing demand for faster and more efficient data processing. The chip model requires the use of HDL language for programming, and a case study of an image processing application is presented to illustrate its use. It is important to take into consideration the power consumption and the temperature of the device when using the EPF10K50SBC356-1X chip model.
You May Also Be Interested In
5,847 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |