Intel Corporation
EPF10K200SBI356-2
EPF10K200SBI356-2 ECAD Model
EPF10K200SBI356-2 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 274 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1.27 MM PITCH, BGA-356 | |
| Pin Count | 356 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K200SBI356-2 Overview
The EPF10K200SBI356-2 chip model is a high-performance, versatile chip model that is suitable for various applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming. This chip model has been designed to provide users with a powerful platform for their projects, with the possibility of future upgrades to support more advanced communication systems.
The EPF10K200SBI356-2 chip model has a wide range of features that make it an ideal choice for a variety of applications. It has a large capacity of 200kbits, allowing for high-speed data processing and storage. It also offers a wide range of input/output options, including USB, Ethernet, and CAN bus. Additionally, it is equipped with an integrated flash memory, allowing for quick and easy programming.
In terms of design, the EPF10K200SBI356-2 chip model is designed to be flexible and easy to use. It is designed to be compatible with most HDL languages, allowing users to quickly and easily create programs that can be used on the chip model. Additionally, the chip model is designed to be easily upgradable, allowing users to add more features and capabilities as their projects evolve.
In terms of actual case studies, the EPF10K200SBI356-2 chip model has been used in a variety of projects, including the development of a high-performance digital signal processor, an embedded processor, and an image processor. In each case, the chip model was able to provide the necessary performance and features needed to complete the project.
When using the EPF10K200SBI356-2 chip model, there are a few precautions that users should take. First, users should ensure that the chip model is properly programmed before use. Additionally, users should be aware of the power requirements of the chip model, as it can draw a significant amount of power if not properly managed. Finally, users should be aware of the temperature range of the chip model, as it can become damaged if it is exposed to temperatures outside of its specified range.
In conclusion, the EPF10K200SBI356-2 chip model is a powerful and versatile chip model that is suitable for a variety of applications. It is designed to be flexible and easy to use, with the possibility of future upgrades to support more advanced communication systems. Additionally, it has been used in a variety of actual case studies, with users reporting positive results. Finally, users should take a few precautions when using the chip model, such as ensuring that it is properly programmed and managed, and that it is not exposed to temperatures outside of its specified range.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||