Intel Corporation
EPF10K250EBC600-3
EPF10K250EBC600-3 ECAD Model
EPF10K250EBC600-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 12160 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B600 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 600 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA600,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 1.93 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA, BGA600,35X35,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K250EBC600-3 Datasheet Download
EPF10K250EBC600-3 Overview
The chip model EPF10K250EBC600-3 is a high-performance, low-power, FPGA device designed for digital signal processing, embedded processing, image processing and other applications. It is based on an advanced HDL language, which provides a powerful platform to design and implement high-performance and low-power systems. With its versatile capabilities, the chip model EPF10K250EBC600-3 can be used in a variety of applications ranging from high-performance digital signal processing to embedded processing and image processing.
The original design intention of the chip model EPF10K250EBC600-3 was to provide a platform for high-performance, low-power, and versatile applications. It was designed to be able to be upgraded in the future to meet the requirements of more advanced applications. This makes it possible for the chip model EPF10K250EBC600-3 to be used in advanced communication systems.
The chip model EPF10K250EBC600-3 can also be applied to networks, providing a powerful platform for intelligent applications. It can be used for a variety of intelligent scenarios, such as machine learning, artificial intelligence, natural language processing, and more. As the world moves towards a more connected and intelligent future, the chip model EPF10K250EBC600-3 will be the perfect platform to power these applications.
The chip model EPF10K250EBC600-3 is a powerful platform that can be used in a variety of applications, from high-performance digital signal processing to intelligent applications. With its versatile capabilities and the ability to be upgraded in the future, the chip model EPF10K250EBC600-3 can be used in advanced communication systems and intelligent scenarios. It is the perfect platform to power the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||