Intel Corporation
EPF10K250EBC600-1
EPF10K250EBC600-1 ECAD Model
EPF10K250EBC600-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 12160 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B600 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 600 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA600,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 1.93 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA, BGA600,35X35,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K250EBC600-1 Datasheet Download
EPF10K250EBC600-1 Overview
The chip model EPF10K250EBC600-1 is a high-performance integrated circuit developed by the semiconductor company Altera. It is the latest addition to the company's FPGA product line and is designed to meet the needs of today's rapidly evolving markets. With its impressive features such as high speed, low power consumption, and scalability, the chip model EPF10K250EBC600-1 is becoming increasingly popular in a variety of industries.
The chip model EPF10K250EBC600-1 has a wide range of applications in the industry. Its high speed and low power consumption make it ideal for a variety of applications, such as the Internet of Things (IoT), data centers, and embedded systems. It can also be used in industrial automation, medical devices, and automotive applications. In addition, its scalability makes it suitable for high-end applications such as artificial intelligence (AI) and machine learning (ML).
In the future, the chip model EPF10K250EBC600-1 is expected to be in high demand in related industries due to its impressive features and scalability. Its high speed and low power consumption will make it a great choice for applications in the IoT, data centers, and embedded systems. It will also be used in industrial automation, medical devices, and automotive applications. Furthermore, its scalability makes it suitable for AI and ML applications.
The chip model EPF10K250EBC600-1 can also be used in networks and intelligent scenarios. It can be used to create intelligent networks to control and monitor devices, as well as to support advanced analytics. It can also be used in the era of fully intelligent systems to create intelligent systems that can make decisions and take actions autonomously.
In conclusion, the chip model EPF10K250EBC600-1 is an impressive integrated circuit that is becoming increasingly popular in a variety of industries. It is expected to be in high demand in the future due to its impressive features, scalability, and ability to be used in networks and intelligent scenarios. It is a great choice for applications in the IoT, data centers, and embedded systems, as well as industrial automation, medical devices, and automotive applications. Additionally, it is suitable for AI and ML applications, and can be used to create intelligent networks and fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||