EPF10K200SBC600-2X
EPF10K200SBC600-2X
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rohs

Intel Corporation

EPF10K200SBC600-2X


EPF10K200SBC600-2X
F18-EPF10K200SBC600-2X
Active
IC FPGA 470 I/O 600BGA
600-BGA (45x45)

EPF10K200SBC600-2X ECAD Model


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EPF10K200SBC600-2X Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 600 ps
Number of Inputs 470
Number of Outputs 470
Number of Logic Cells 9984
Number of I/O Lines 470
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 470 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B600
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 600
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA600,35X35,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 1.93 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 45 X 45 MM, 1.27 MM PITCH, BGA-600
Pin Count 600
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K200SBC600-2X Overview



The chip model EPF10K200SBC600-2X is a powerful, versatile, and reliable integrated circuit (IC) that has been used in a variety of industries, from automotive to medical. It is designed to be a cost-effective solution for many applications, offering high performance and low power consumption. The chip model EPF10K200SBC600-2X is capable of providing excellent performance in a wide range of applications, from high-end embedded systems to low-end consumer electronics.


The industry trends of the chip model EPF10K200SBC600-2X are constantly evolving, and it is likely that the model will be used in a variety of new and exciting applications in the future. As new technologies are developed and become more widely available, the chip model EPF10K200SBC600-2X can be adapted to take advantage of them. This could include the use of artificial intelligence (AI) and machine learning (ML) to improve its performance, as well as the use of more advanced communication protocols to enable faster data transfer.


In terms of networks, the chip model EPF10K200SBC600-2X can be used to build reliable and secure networks that can support a variety of applications. The chip model is also capable of supporting intelligent scenarios, such as those found in the Internet of Things (IoT). The chip model can be used to create intelligent systems that can interact with each other and with the environment in order to provide useful services.


The chip model EPF10K200SBC600-2X can also be used in the development and popularization of future intelligent robots. The chip model can be used to create robots that are capable of performing complex tasks, such as those found in manufacturing, healthcare, and other industries. In order to use the chip model effectively, a team of experienced engineers and developers is needed. These professionals should have a strong understanding of the chip model, as well as a comprehensive knowledge of the technologies that are necessary to make the chip model work.


In conclusion, the chip model EPF10K200SBC600-2X is a powerful, versatile, and reliable IC that has the potential to be used in a variety of applications. The industry trends and future development of the chip model will depend on the specific technologies that are necessary to make the chip model work. The chip model can be used to create reliable and secure networks, as well as intelligent systems and robots, but it will require the expertise of experienced engineers and developers to make the most of its capabilities.



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