EPF10K130EBC600-1X
EPF10K130EBC600-1X
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rohs

Intel Corporation

EPF10K130EBC600-1X


EPF10K130EBC600-1X
F18-EPF10K130EBC600-1X
Active
IC FPGA 424 I/O 600BGA
600-BGA (45x45)

EPF10K130EBC600-1X ECAD Model


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EPF10K130EBC600-1X Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 300 ps
Number of Inputs 424
Number of Outputs 424
Number of Logic Cells 6656
Number of I/O Lines 424
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 424 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B600
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 600
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA600,35X35,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 1.93 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA600,35X35,50
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 600

EPF10K130EBC600-1X Overview



The chip model EPF10K130EBC600-1X is a powerful and versatile model that has been widely used in the field of electronic engineering. It is a high-performance, low-power integrated circuit that is designed for a wide range of applications, from simple logic functions to complex digital signal processing. This chip model has been widely used in the fields of communication, industrial control, and consumer electronics.


The industry trends of the chip model EPF10K130EBC600-1X are constantly evolving, with new technologies and applications being developed on a regular basis. As such, the future development of related industries is likely to be heavily dependent on the application environment and the specific technologies needed to support it. For example, communication systems may require the support of advanced communication technologies such as Wi-Fi or Bluetooth, while industrial control systems may require the support of embedded systems and industrial automation technologies.


The original design intention of the chip model EPF10K130EBC600-1X was to provide a reliable and cost-effective solution for a wide range of applications. As such, the possibility of future upgrades is likely to depend on the specific application environment and the technologies needed to support it. For example, the chip model may need to be upgraded to support the development and popularization of future intelligent robots, which may require the support of artificial intelligence and machine learning technologies.


In order to effectively use the chip model EPF10K130EBC600-1X, technical talents with a deep understanding of the specific application environment and the technologies needed to support it are needed. This includes knowledge of the chip model itself, as well as the technologies required to effectively implement the application. In addition, technical talents with the ability to troubleshoot and debug any issues that may arise during the development and implementation of the chip model are also required.



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