
Intel Corporation
EPF10K130EBC600-1X
EPF10K130EBC600-1X ECAD Model
EPF10K130EBC600-1X Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 300 ps | |
Number of Inputs | 424 | |
Number of Outputs | 424 | |
Number of Logic Cells | 6656 | |
Number of I/O Lines | 424 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 424 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B600 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 600 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA600,35X35,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 1.93 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA600,35X35,50 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 600 |
EPF10K130EBC600-1X Overview
The chip model EPF10K130EBC600-1X is a powerful and versatile model that has been widely used in the field of electronic engineering. It is a high-performance, low-power integrated circuit that is designed for a wide range of applications, from simple logic functions to complex digital signal processing. This chip model has been widely used in the fields of communication, industrial control, and consumer electronics.
The industry trends of the chip model EPF10K130EBC600-1X are constantly evolving, with new technologies and applications being developed on a regular basis. As such, the future development of related industries is likely to be heavily dependent on the application environment and the specific technologies needed to support it. For example, communication systems may require the support of advanced communication technologies such as Wi-Fi or Bluetooth, while industrial control systems may require the support of embedded systems and industrial automation technologies.
The original design intention of the chip model EPF10K130EBC600-1X was to provide a reliable and cost-effective solution for a wide range of applications. As such, the possibility of future upgrades is likely to depend on the specific application environment and the technologies needed to support it. For example, the chip model may need to be upgraded to support the development and popularization of future intelligent robots, which may require the support of artificial intelligence and machine learning technologies.
In order to effectively use the chip model EPF10K130EBC600-1X, technical talents with a deep understanding of the specific application environment and the technologies needed to support it are needed. This includes knowledge of the chip model itself, as well as the technologies required to effectively implement the application. In addition, technical talents with the ability to troubleshoot and debug any issues that may arise during the development and implementation of the chip model are also required.
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