EPF10K200SBC356-1X
EPF10K200SBC356-1X
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rohs

Intel Corporation

EPF10K200SBC356-1X


EPF10K200SBC356-1X
F18-EPF10K200SBC356-1X
Active
IC FPGA 274 I/O 356BGA
356-BGA (35x35)

EPF10K200SBC356-1X ECAD Model


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EPF10K200SBC356-1X Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 300 ps
Number of Inputs 274
Number of Outputs 274
Number of Logic Cells 9984
Number of I/O Lines 274
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 274 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B356
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20
Number of Terminals 356
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA356,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.63 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-356
Pin Count 356
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
ECCN Code 3A991.D

EPF10K200SBC356-1X Overview



The chip model EPF10K200SBC356-1X is an advanced model from the FPGA family, which is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. This model is designed to be used with the HDL language for the best results. It is an ideal choice for engineers and developers who need to create complex designs and develop advanced applications.


The EPF10K200SBC356-1X is a powerful and reliable chip model that offers high-performance processing capabilities. It is fully compatible with the HDL language and can easily be integrated into existing designs. This model also provides the flexibility to create complex designs and develop advanced applications.


The EPF10K200SBC356-1X is an ideal choice for engineers and developers who need to create complex designs and develop advanced applications. It is also suitable for applications that require high-performance digital signal processing, embedded processing, image processing, and other applications. In addition, it also provides a number of features that make it a great choice for developers who need to create high-performance designs.


The EPF10K200SBC356-1X can also be used in the development and popularization of future intelligent robots. This chip model is designed to be used with the HDL language and can easily be integrated into existing designs. It is also capable of handling complex algorithms, which makes it an ideal choice for robots that need to perform complex tasks.


In order to use the EPF10K200SBC356-1X effectively, developers need to have the necessary technical skills and knowledge. This includes knowledge of the HDL language, as well as knowledge of the different types of hardware and software components that are used in the development of advanced applications. It also requires knowledge of the different types of algorithms used in the development of robots, as well as an understanding of the different types of sensors and actuators used in robotic applications.


Overall, the EPF10K200SBC356-1X is a powerful and reliable chip model that offers high-performance processing capabilities. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is also capable of handling complex algorithms, which makes it an ideal choice for robots that need to perform complex tasks. In order to use the EPF10K200SBC356-1X effectively, developers need to have the necessary technical skills and knowledge.



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