
Intel Corporation
EPF10K100EBC356-3
EPF10K100EBC356-3 ECAD Model
EPF10K100EBC356-3 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 700 ps | |
Number of Inputs | 274 | |
Number of Outputs | 274 | |
Number of Logic Cells | 4992 | |
Number of I/O Lines | 274 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 274 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B356 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Number of Terminals | 356 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA356,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.63 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1.27 MM PITCH, BGA-356 | |
Pin Count | 356 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K100EBC356-3 Overview
The chip model EPF10K100EBC356-3 is a powerful and versatile model that can be used for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It requires the use of HDL language to program the chip, making it an ideal choice for engineers and developers who are looking to create efficient and reliable systems.
The EPF10K100EBC356-3 can be used in a wide range of networks and intelligent scenarios. This chip model can be used to create systems with sophisticated algorithms and powerful computing capabilities that can process data quickly and accurately. It can be used to develop and popularize future intelligent robots, as it can provide the necessary computational power and accuracy for complex tasks.
Furthermore, the EPF10K100EBC356-3 can be used in the era of fully intelligent systems. With its advanced capabilities, the chip model can be used to create systems that can interact with the environment and make decisions based on data collected from the environment. This chip model can also be used to create systems that can learn from their experiences and adapt to changing conditions.
In order to use the EPF10K100EBC356-3 effectively, certain technical talents are needed. Knowledge of HDL language is essential for programming the chip, while knowledge of computer networks and artificial intelligence is necessary for creating intelligent systems. Furthermore, knowledge of robotics and engineering is also necessary for developing and popularizing future intelligent robots.
Overall, the EPF10K100EBC356-3 is a powerful and versatile chip model that can be used for a variety of applications. It can be used in networks and intelligent scenarios, as well as in the era of fully intelligent systems. With the right technical talents, the EPF10K100EBC356-3 can be used to create powerful and reliable systems that can interact with their environment and make decisions based on data collected from the environment. Furthermore, it can also be used to develop and popularize future intelligent robots.
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4,258 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $198.9783 | $198.9783 |
10+ | $196.8388 | $1,968.3878 |
100+ | $186.1410 | $18,614.1024 |
1000+ | $175.4433 | $87,721.6320 |
10000+ | $160.4664 | $160,466.4000 |
The price is for reference only, please refer to the actual quotation! |