Intel Corporation
EP20K60EFC144-1
EP20K60EFC144-1 ECAD Model
EP20K60EFC144-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.72 ns | |
| Number of Inputs | 85 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 2560 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 93 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 93 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA144,12X12,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP20K60EFC144-1 Datasheet Download
EP20K60EFC144-1 Overview
The chip model EP20K60EFC144-1 is a powerful and versatile integrated circuit that offers a wide range of advantages for its users. This model is designed to provide a high-speed, low-power solution for a range of applications. It features a low-power, high-speed core processor, a dedicated Ethernet controller, and a full suite of peripherals. This chip model is also designed to be compatible with a wide range of communication protocols, making it suitable for a variety of applications.
The EP20K60EFC144-1 chip model offers a number of advantages for its users. It is designed to provide a low-power solution with a high-speed core processor, a dedicated Ethernet controller, and a full suite of peripherals. Additionally, it is designed to be compatible with a wide range of communication protocols, making it suitable for a variety of applications. This chip model is also designed to be highly reliable, with a long life expectancy and low failure rate.
The expected demand for the EP20K60EFC144-1 chip model is expected to increase in the future due to its versatile design and wide range of applications. This chip model is suitable for a variety of industries, including telecommunications, automotive, medical, and consumer electronics. As the demand for more advanced communication systems increases, the EP20K60EFC144-1 chip model is expected to become increasingly popular and in demand.
The original design intention of the EP20K60EFC144-1 chip model was to provide a low-power, high-speed solution for a range of applications. It is designed to be highly reliable, with a long life expectancy and low failure rate, and is also designed to be compatible with a wide range of communication protocols. This chip model is also designed to be upgradable, making it possible to upgrade the chip model in the future as new technologies become available.
The EP20K60EFC144-1 chip model can be applied to a variety of advanced communication systems. It is suitable for use in networks, and can be used to facilitate data transfer and communication between multiple devices. Additionally, the chip model can be used in intelligent scenarios, such as autonomous vehicles, automated factories, and home automation systems. This chip model is also suitable for use in the era of fully intelligent systems, as it is designed to be highly reliable and upgradable.
In conclusion, the EP20K60EFC144-1 chip model is a powerful and versatile integrated circuit that offers a wide range of advantages for its users. It is designed to provide a low-power, high-speed solution for a range of applications, and is compatible with a wide range of communication protocols. This chip model is expected to become increasingly popular and in demand in the future due to its versatile design and wide range of applications. Additionally, this chip model is designed to be upgradable, making it possible to upgrade the chip model in the future as new technologies become available. Finally, this chip model can be applied to a variety of advanced communication systems, and can be used to facilitate data transfer and communication between multiple devices, as well as in intelligent scenarios.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||