Intel Corporation
EP20K30EFI144-2XN
EP20K30EFI144-2XN ECAD Model
EP20K30EFI144-2XN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 2.69 ns | |
| Number of Inputs | 85 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 1200 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 93 | |
| Programmable Logic Type | LOADABLE PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 93 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA144,12X12,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP20K30EFI144-2XN Datasheet Download
EP20K30EFI144-2XN Overview
The chip model EP20K30EFI144-2XN is a highly advanced integrated circuit that has been designed to meet the needs of the modern networked world. It has been designed to be a highly efficient, reliable and cost-effective solution for a wide range of applications. It is a highly integrated system-on-chip (SoC) that combines a variety of functions including high-speed data processing, memory management, communication and control.
The EP20K30EFI144-2XN chip model has a number of advantages that make it an attractive choice for a wide range of industries. It is capable of providing high-speed data processing, memory management, communication and control. This makes it an ideal choice for a variety of applications such as high-speed wireless networks, data centers, and embedded systems. Additionally, the chip model has a small form factor which makes it easy to integrate into existing systems.
The EP20K30EFI144-2XN chip model is also capable of providing a wide range of features that make it suitable for a variety of applications. It is capable of providing high-speed data transmission, low-latency communication, and a wide range of control functions. Additionally, the chip model is designed to be highly efficient, reliable and cost-effective. This makes it an ideal choice for a variety of industries such as industrial automation, medical devices, automotive, and consumer electronics.
The EP20K30EFI144-2XN chip model is also designed to be highly upgradable. This means that it can be easily upgraded to meet the needs of the latest technologies and applications. Additionally, it is capable of being used in advanced communication systems such as 5G networks, high-speed wireless networks, and satellite networks. This makes it a great choice for a variety of applications such as advanced communication systems, Internet of Things (IoT) applications, and mobile applications.
The EP20K30EFI144-2XN chip model is also capable of being used in a variety of intelligent scenarios. This includes applications such as artificial intelligence (AI), natural language processing (NLP), and machine learning (ML). Additionally, the chip model is capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes. This makes it a great choice for a variety of applications that require intelligent systems.
The EP20K30EFI144-2XN chip model is an ideal choice for a variety of industries that require high-speed data processing, memory management, communication and control. It is highly efficient, reliable and cost-effective, and it is capable of being upgraded to meet the needs of the latest technologies and applications. Additionally, it is capable of being used in a variety of intelligent scenarios and in the era of fully intelligent systems. As such, it is expected to be in high demand in the future.
You May Also Be Interested In
2,048 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||