Intel Corporation
EP20K300EFC672-3
EP20K300EFC672-3 ECAD Model
EP20K300EFC672-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 3.06 ns | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 11520 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 408 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 408 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FINE LINE, BGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K300EFC672-3 Datasheet Download
EP20K300EFC672-3 Overview
The EP20K300EFC672-3 chip model is an advanced programmable logic device that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is designed to be programmed using the HDL language, which is an industry-standard programming language for designing digital circuits.
The EP20K300EFC672-3 chip model is designed to provide high-performance computing capabilities and is suitable for a wide range of applications. It is capable of handling complex tasks such as digital signal processing, embedded processing, and image processing. The chip model also provides high-speed data transfer capabilities, allowing for faster data processing and improved system performance.
The EP20K300EFC672-3 chip model is an ideal choice for applications that require high-performance computing capabilities. It is also suitable for applications that require the support of new technologies, such as artificial intelligence (AI), machine learning, and deep learning. This chip model can be used to develop applications that require the use of advanced algorithms and data processing techniques.
The product description of the EP20K300EFC672-3 chip model includes detailed information about its features, specifications, and design requirements. The product description also includes information about the power requirements, temperature range, and other environmental factors that the chip model must meet. Additionally, the product description includes information about the actual case studies and precautions that must be taken when using the chip model.
The industry trends of the EP20K300EFC672-3 chip model and the future development of related industries will depend on the specific technologies needed. As the demand for high-performance computing capabilities increases, new technologies such as AI, machine learning, and deep learning will be needed to support the application environment. The EP20K300EFC672-3 chip model is an ideal choice for applications that require the use of advanced algorithms and data processing techniques.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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