Intel Corporation
EP20K300EFC672-1X
EP20K300EFC672-1X ECAD Model
EP20K300EFC672-1X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.68 ns | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 11520 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 408 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 408 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FINE LINE, BGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EP20K300EFC672-1X Datasheet Download
EP20K300EFC672-1X Overview
The chip model EP20K300EFC672-1X is a powerful and versatile device that is highly suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and more. This chip model is designed to be compatible with a variety of HDL languages, making it a great choice for those looking for a reliable and cost-effective solution.
The EP20K300EFC672-1X chip model offers many advantages over other models, such as its high-speed data transfer capabilities, its low power consumption, and its high reliability. This makes it an ideal choice for those looking for a reliable and cost-effective solution. Additionally, the chip model is designed to be compatible with a variety of HDL languages, which makes it a great choice for those looking for a reliable and cost-effective solution.
In terms of future development, the chip model EP20K300EFC672-1X is expected to see increasing demand in various industries. This is due to the fact that the chip model is designed to be compatible with a variety of HDL languages, which makes it a great choice for those looking for a reliable and cost-effective solution. Additionally, the chip model is designed to be compatible with a variety of new technologies, making it an ideal choice for those looking for a reliable and cost-effective solution.
Overall, the chip model EP20K300EFC672-1X is a powerful and versatile device that is highly suitable for a variety of applications. It is designed to be compatible with a variety of HDL languages, making it a great choice for those looking for a reliable and cost-effective solution. Additionally, the chip model is designed to be compatible with a variety of new technologies, making it an ideal choice for those looking for a reliable and cost-effective solution. As a result, the chip model is expected to see increasing demand in various industries in the future.
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5,891 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $389.5307 | $389.5307 |
| 10+ | $385.3422 | $3,853.4218 |
| 100+ | $364.3997 | $36,439.9674 |
| 1000+ | $343.4572 | $171,728.5820 |
| 10000+ | $314.1377 | $314,137.6500 |
| The price is for reference only, please refer to the actual quotation! | ||