
Intel Corporation
EP20K200EFC672-2X
EP20K200EFC672-2X ECAD Model
EP20K200EFC672-2X Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 1.97 ns | |
Number of Inputs | 368 | |
Number of Outputs | 368 | |
Number of Logic Cells | 8320 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 376 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 376 I/O | |
Clock Frequency-Max | 160 MHz | |
Output Function | MACROCELL | |
Power Supplies | 1.8,1.8/3.3 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FINE LINE, BGA-672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EP20K200EFC672-2X Datasheet Download
EP20K200EFC672-2X Overview
The EP20K200EFC672-2X chip model is a powerful and versatile tool designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a field-programmable gate array (FPGA) with the ability to be configured using a hardware description language (HDL). This allows for the implementation of complex logic functions and the ability to quickly modify and upgrade the chip to meet the needs of the user.
The EP20K200EFC672-2X model is an ideal choice for advanced communication systems. It is capable of handling high-speed data streams and is equipped with powerful logic functions that enable the development of sophisticated communication systems. Furthermore, its flexibility allows for the easy integration of other components into the system. This makes it possible to quickly upgrade the communication system to meet the needs of the user.
The EP20K200EFC672-2X chip model is also suitable for the development and popularization of future intelligent robots. It provides the necessary logic functions to enable the robot to interact with its environment and respond to user commands. Furthermore, the chip's flexibility allows for the integration of other components, such as sensors and cameras, which can be used to enable the robot to interact with its environment.
In order to effectively use the EP20K200EFC672-2X chip model, it is necessary to have a good understanding of HDL programming. This requires a good understanding of the fundamentals of digital logic and computer architecture. Furthermore, knowledge of the specific chip model and its features is essential in order to effectively program and debug the chip.
In conclusion, the EP20K200EFC672-2X chip model is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. It is also suitable for the development and popularization of future intelligent robots. In order to effectively use the chip model, it is necessary to have a good understanding of HDL programming and the specific chip model and its features.
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