Intel Corporation
EP20K200BC356-3V
EP20K200BC356-3V ECAD Model
EP20K200BC356-3V Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 271 | |
| Number of Outputs | 271 | |
| Number of Logic Cells | 8320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 277 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 277 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 356 |
EP20K200BC356-3V Overview
The chip model EP20K200BC356-3V is a powerful and reliable FPGA chip, which is widely used in high-performance digital signal processing, embedded processing, image processing and other scenarios. It is capable of handling complex tasks and requires the use of HDL language.
The EP20K200BC356-3V chip model is a versatile device that can be used in a variety of applications. It is suitable for a wide range of industries, including automotive, aerospace, medical, industrial, and consumer electronics. As the demand for high-performance digital signal processing and embedded processing increases, the chip model is expected to become even more popular.
The EP20K200BC356-3V chip model is also applicable to networks, enabling the creation of intelligent systems. It can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It is capable of handling complex tasks, such as image recognition, natural language processing, and machine learning. As the demand for intelligent systems increases, the chip model is expected to become even more popular.
The EP20K200BC356-3V chip model is also well-suited for the era of fully intelligent systems. It is capable of handling complex tasks and is compatible with a variety of technologies, such as artificial intelligence, blockchain, and 5G. As the demand for these technologies increases, the chip model is expected to become even more popular.
In conclusion, the EP20K200BC356-3V chip model is a powerful and reliable FPGA chip that is suitable for a wide range of applications. It is compatible with a variety of technologies and is suitable for a variety of intelligent scenarios. As the demand for high-performance digital signal processing and embedded processing increases, the chip model is expected to become even more popular.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||