
Intel Corporation
EP20K100BI356-3
EP20K100BI356-3 ECAD Model
EP20K100BI356-3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 246 | |
Number of Outputs | 246 | |
Number of Logic Cells | 4160 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 252 | |
Programmable Logic Type | LOADABLE PLD | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 252 I/O | |
Output Function | MACROCELL | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B356 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 356 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA356,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.63 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | LBGA, BGA356,26X26,50 | |
Pin Count | 356 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EP20K100BI356-3 Overview
The chip model EP20K100BI356-3 is a high-performance, low-power field programmable gate array (FPGA) device developed by Altera Corporation. It is a member of the Stratix II family of FPGAs, and is designed to improve the performance of system designs. This model is designed to be used in a wide range of applications, including communications, networking, industrial, automotive, and aerospace.
The EP20K100BI356-3 chip model has several advantages over other FPGA models. It has a large capacity, with up to 20,000 logic elements and up to 25,000 memory bits. It also features dynamic partial reconfiguration, which allows parts of the chip to be reconfigured without having to shut down the entire system. Additionally, it has a high-speed transceiver, which allows for high-speed data transfer.
In terms of future development trends, the EP20K100BI356-3 chip model is expected to be used in a variety of applications, such as wireless communication, automotive, industrial, and aerospace. It is also expected to be used in advanced communication systems, such as 5G and beyond. This is due to its high-speed transceiver, which allows for data transfer at high speeds. Additionally, its dynamic partial reconfiguration feature makes it suitable for applications that require flexibility and scalability.
The original design intention of the EP20K100BI356-3 chip model was to provide a high-performance, low-power FPGA solution for a wide range of applications. It was designed to be used in systems that require high-speed data transfer, as well as flexibility and scalability. As technology advances, it is possible that the chip model may require upgrades in order to remain compatible with the latest technologies.
In conclusion, the EP20K100BI356-3 chip model is a high-performance, low-power field programmable gate array device that is designed to be used in a wide range of applications. It has several advantages, such as a large capacity, dynamic partial reconfiguration, and a high-speed transceiver, which make it suitable for advanced communication systems. It is expected to be used in a variety of applications in the future, and may require upgrades in order to remain compatible with the latest technologies.
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QTY | Unit Price | Ext Price |
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