Intel Corporation
10AX032E4F29I3SG
10AX032E4F29I3SG ECAD Model
10AX032E4F29I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX032E4F29I3SG Overview
The chip model 10AX032E4F29I3SG is an advanced and powerful integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is built with the latest technology and requires the use of HDL language for programming. This chip model is the perfect choice for those who are looking for a reliable and efficient solution for their digital signal processing needs.
The chip model 10AX032E4F29I3SG is built with the latest technology and is suitable for a wide range of applications. It can be used in a variety of industries such as automotive, medical, aerospace, and consumer electronics. Furthermore, it is also suitable for applications such as machine learning, artificial intelligence, and robotics. The chip model is also capable of handling complex tasks such as image processing, speech recognition, and natural language processing.
The industry trends of the chip model 10AX032E4F29I3SG will depend on the specific technologies needed for the application environment. As technology advances, new technologies may be required to make the chip model even more powerful and efficient. With the development of the internet of things, cloud computing, and 5G, the chip model 10AX032E4F29I3SG will be able to support new technologies and applications.
The chip model 10AX032E4F29I3SG can be used in networks and intelligent scenarios in the future. It is possible to use the chip model in the era of fully intelligent systems. It can be used for various applications such as autonomous driving, facial recognition, and medical diagnosis. Furthermore, the chip model can be used for other applications such as virtual reality, augmented reality, and robotics.
In conclusion, the chip model 10AX032E4F29I3SG is a powerful and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is built with the latest technology and requires the use of HDL language for programming. It is suitable for a wide range of applications and can be used in networks and intelligent scenarios in the future. As technology advances, new technologies may be required to make the chip model even more powerful and efficient.
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1,379 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,307.4412 | $3,307.4412 |
| 10+ | $3,271.8773 | $32,718.7733 |
| 100+ | $3,094.0579 | $309,405.7908 |
| 1000+ | $2,916.2385 | $1,458,119.2440 |
| 10000+ | $2,667.2913 | $2,667,291.3000 |
| The price is for reference only, please refer to the actual quotation! | ||